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SMT Technology Expert (Soldering & PCB assembly)


Job Location:

Chengdu - China

Monthly Salary: Not provided by the employer
Posted: 22 August 2026 (Yesterday)
Application Deadline: 19 November 2026
Vacancies: 1 Vacancy

Job Summary

MonolithicPowerSystemsInc.(MPS)---comejoinourteamandseehowYOUcanmakeadifference.

Job Description:

Summary:

We are seeking an experienced SMT (Surface Mount Technology) Technology Expert to serve as the primary technical authority for resolving complex chip soldering defects encountered at customer sites.

You will be responsible for root-cause analysis of field failures optimizing reflow profiles selecting advanced solder materials and providing critical Design-for-Manufacturing (DFM) feedback to our internal R&D teams to ensure first-pass yield and long-term reliability.

RESPONSIBILITIES:

Customer Site Support & Failure Analysis

  • Act as the technical leader for SMT-related issues reported by customers (e.g. tombstoning voiding head-in-pillow cold joints opens and excessive warpage).

Process & Materials Optimization

  • Evaluate and select appropriate solder paste (Type 4/5/6 powders alloys fluxes) based on pad design and component pitch.
  • Develop optimize and validate reflow oven profiles (soak zone peak temperature TAL) specifically tailored for our chip packages (QFN BGA LGA etc.) to minimize thermal stress and warpage.
  • Define stencil design specifications (aperture thickness step-down/stencil nano-coating) to improve solder paste release and reduce voiding.

Design Guidance & DFM/DFA

  • Review and approve PCB landing pad designs (SMD/NSMD pads) to ensure compatibility with high-volume SMT assembly.
  • Collaborate with Package/R&D engineers to provide Package-to-Board interaction guidelines.
  • Advice on substrate design surface finish (NiAu ENIG ENEPIG OSP Immersion Ag) and solder mask definitions to prevent solderability issues.

Advanced Technical Consulting (Preferred)

  • Influence IC Package Design at the early stage by providing insights into how package construction (die attach warpage control ball layout) affects SMT yields.
  • Establish internal standards for SMT assembly of new products (NPI - New Product Introduction).

Perform other tasks assigned by superiors.

REQUIREMENTS:

  • Education: Bachelors or Masters degree in Mechanical Engineering Materials Science Electronics Engineering or related fields.
  • Experience: 8 years of hands-on experience in SMT process engineering preferably within the semiconductor OSAT or EMS industries.

Monolithic Power Systems Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race color religion sex sexual orientation gender identity national origin age disability protected veteran status or special disabled veteran marital status pregnancy genetic information or any other legally protected status.


About Company

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Monolithic Power Systems, Inc. (MPS) provides small, highly energy efficient, easy-to-use power management solutions for electronic systems found in industrial applications, telecom infrastructure, cloud computing, automotive, and consumer applications

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