Senior Power Packaging Engineer

MonolithicPowerSystemsInc.(MPS)---comejoinourteamandseehowYOUcanmakeadifference.

Job Description:

Summary:

• The primary responsibilities will focus on Design for Manufacturability (DFM) for PCB and PCBA.
• Driving the engineering development process from concept to mass production and resolving complex engineering challenges.
• The candidate will possess deep expertise in substrate/board-level design rules materials assembly processes and failure analysis to ensure robust reliable and cost-effective module packaging solutions.
• Lead the end-to-end packaging structural design and process development for 800VDC/400VDC to 48V/12V/6V Power Shelf and PDB products in high power-density applications.

RESPONSIBILITIES:

• Establish and enforce comprehensive DFM guidelines and constraints for PCB fabrication (trace/spacing via design impedance control) and PCBA assembly (component placement solder mask stencil design).
• Proactively identify and mitigate potential manufacturing testability and reliability risks during the design phase.
• Lead the end-to-end engineering development of chip-on-board (CoB) system-in-package (SiP) and other complex module packages.
• Own the process development and qualification for critical PCBA assembly steps including SMT die attach wire bonding/FC underfill molding and final coating.
• Lead the packaging R&D of 800VDC/400VDC to 48V/12V/6V Power Shelf and PDB (Power Distribution Board) products.
• Develop and optimize packaging processes (including soldering potting heatsink assembly insulation treatment etc.) addressing insulation creepage thermal and reliability challenges in medium-to-high voltage environments.
• Participate in the full product development cycle from concept design to mass production validation including prototype building reliability testing process verification and issue resolution.
• Track industry-leading packaging technologies and materials to continuously improve product performance and cost efficiency.

REQUIREMENTS:

Education: Bachelors degree or above in Power Electronics Mechanical Engineering Materials Science Microelectronics Packaging or related fields.

Experience:

• Expert-level knowledge of PCB/PCBA design materials and fabrication/assembly processes. Familiarity with IPC standards is required.
• Deep understanding of SMT flip-chip wire-bond underfill and molding processes for advanced packages.

• Experience in structural design packaging development and process implementation for Power Shelf PDB or similar high-voltage power systems is highly preferred.
• Minimum of 5 years of hands-on experience with a strong focus on module-level development PCB/PCBA DFM and process engineering.

Technical Skills:

• Proficient in mechanical design tools such as SolidWorks AutoCAD;
• Familiar with power device packaging (SiC/GaN) potting materials connector selection and high power-density assembly processes;
• Strong process development capability with the ability to independently resolve issues in soldering mechanical assembly and reliability failure analysis.

Monolithic Power Systems Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race color religion sex sexual orientation gender identity national origin age disability protected veteran status or special disabled veteran marital status pregnancy genetic information or any other legally protected status.