Module Packaging Manager

MonolithicPowerSystemsInc.(MPS)---comejoinourteamandseehowYOUcanmakeadifference.

Job Description:

Summary:

The primary responsibilities will focus on Design for Manufacturability (DFM) for PCB and PCBA. Driving the engineering development process from concept to mass production and resolving complex engineering challenges. The candidate will possess deep expertise in substrate/board-level design rules materials assembly processes and failure analysis to ensure robust reliable and cost-effective module packaging solutions.

RESPONSIBILITIES:

• DFM Leadership for PCB/PCBA: Serve as the DFM authority for module packaging conducting thorough design reviews of PCB layout stack-up and PCBA assembly drawings.

• Establish and enforce comprehensive DFM guidelines and constraints for PCB fabrication (trace/spacing via design impedance control) and PCBA assembly (component placement solder mask stencil design).

• Collaborate closely with IC substrate and board design teams to optimize designs for yield reliability and cost-effectiveness.

• Proactively identify and mitigate potential manufacturing testability and reliability risks during the design phase.

• Lead the end-to-end engineering development of chip-on-board (CoB) system-in-package (SiP) and other complex module packages.

• Own the process development and qualification for critical PCBA assembly steps including SMT die attach wire bonding/FC underfill molding and final coating.

• Lead root cause analysis and resolution of engineering issues arising during NPI and high-volume manufacturing utilizing structured problem-solving methodologies (8D DMAIC).

REQUIREMENTS:

• Expert-level knowledge of PCB/PCBA design materials and fabrication/assembly processes. Familiarity with IPC standards is required.

• Deep understanding of SMT flip-chip wire-bond underfill and molding processes for advanced packages.

• Proficient in using DFM analysis software and CAD tools (e.g. CAM350 Allegro AutoCAD).

• Strong experience in Failure Analysis techniques (X-ray SEM/EDX CSAM cross-sectioning) and Design of Experiments (DOE).

• Minimum of 10 years of hands-on experience with a strong focus on module-level development PCB/PCBA DFM and process engineering

Monolithic Power Systems Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race color religion sex sexual orientation gender identity national origin age disability protected veteran status or special disabled veteran marital status pregnancy genetic information or any other legally protected status.