التالي
Renesas Electronics
Lead Test Operations and Backend Manufacturing to support business growth operational excellence and manufacturing efficiency. Drive continuous improvement in cost quality productivity automation and capacity readiness while ensuring achievement of key operational KPIs and AOP targets
Lead Test Operations and Backend Manufacturing to support business growth operational excellence and manufacturing efficiency. Drive continuous improvement in cost quality productivity automation and capacity readiness while ensuring achievement of key operational KPIs and AOP targets
Renesas Electronics
Key Responsibilities- Take on wire bonding (WB) process development for new products and packages (e.g. Cu/Au wire) including establishing process window and bonding conditions independently.- Drive NPI activities covering development validation data analysis yield improvement SPC and
Key Responsibilities- Take on wire bonding (WB) process development for new products and packages (e.g. Cu/Au wire) including establishing process window and bonding conditions independently.- Drive NPI activities covering development validation data analysis yield improvement SPC and
