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We are seeking experienced professionals for upcoming Instrumentation (I&C) department positions based in the Western United States (preferably in Billings MT or Ferndale WA) to work in a collaborative multi-discipline environment to complete the design and engineering of I&C scope for various and d...

The Signal-Integrity & Packaging (SIP) team manages the external electrical interfaces of Annapurna Labs chip devices focusing on signal integrity power integrity and electrical usage.The team collaborates with the BackEnd team to integrate interfaces into the die designs package layouts for BGA sub...

Annapurna Labs as part of Amazon is looking for a Mechanical Design Engineer to help define shape and integrate cutting-edge solutions for the next generation of our cloud this role you will drive innovation by developing advanced electronics packaging solutions to enhance AWS products and services...