Substrate Technologist

Apple


Job Location:

Irvine, CA - USA

Monthly Salary: Not Disclosed
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

At Apple we believe new insights have a way of becoming extraordinary products services and customer experiences very quickly. Our Hardware Technology Packaging team invents designs develops and integrates electronic packaging solutions for Apples internal and custom external components of hardware for its consumer electronic products such as iPhone iPad Mac Apple Watch Apple TV this highly visible role you will own and drive sophisticated package selection new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design technology manufacturing and reliability and future roadmap; and work with a cross-functional team to achieve the best package performance.

- Lead RFSIP package substrate development pathfinding technology and roadmap definition.n- Work with substrate manufacturing industry foundry and OSAT to bring package substrate solution from concept to HVM.n- Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.n- Drive industry with sophisticated package solutions new material development and specs.n- 5% International travel.

Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging with cross-functional groups to define u0026 optimize new package substrate architectures based on performance technical risk cost and availability solving of technical issues during the full product development cycle.

BS and 10 years of relevant industry experience.

MS or Ph.D. and 5 years of relevant industry fundamentals in the material/chemistry/ or mechanical engineering field(s).nIn-depth knowledge of substrate technology manufacturing process design rules and -on experience in substrate manufacturing and technology development: Cu plating Lithography Dielectric material Laser via formation Solder resist with package assembly and integration process in Cadence Allegro platform tools and design review for manufacturing (DFM).nExceptional technology development u0026 project management communication u0026 collaborative skills.

Required Experience:

IC

At Apple we believe new insights have a way of becoming extraordinary products services and customer experiences very quickly. Our Hardware Technology Packaging team invents designs develops and integrates electronic packaging solutions for Apples internal and custom external components of hardware ...

About Company

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Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more

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