Sr. Director, Package Development Engineering

About SiTime

SiTime is the Precision Timing company.

Timing is the heartbeat of all electronics ensuring performance resilience and scalability. For decades quartz devices non-silicon technology have kept systems in sync but they struggle in harsher more demanding environments. MEMS-based Precision Timing delivers greater accuracy smaller size and resilience. Today MEMS timing powers over 400 applications including high-growth ones in AI datacenters automated driving industrial and humanoid robots wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance smaller size lower power and better reliability. With more than 4 billion devices shipped SiTime is changing the timing industry. For more information visit:.

Job Summary

SiTime seeks a seasoned leader to drive its packaging technology. This individual will drive the execution of SiTimes innovative packaging roadmap. SiTimes packaging leverages conventional and advanced wafer scale packaging technologies to create thermally and mechanically stable environments for co-packaged MEMs. The successful candidate will have expertise in leading innovative teams incorporating new materials and a track record of collaborating closely with development partners. A curiosity to transcend the status quo is welcome and silicon process technology development experience is a strong plus

Responsibilities:

• Packaging Roadmap & Architecture:Define the packaging roadmap that creates the technical capabilities to enable product performance form-factor reliability and cost. Define package requirements and target assembly flows aligned to quality and reliability specifications.
• OSAT Development Collaboration:Lead technical relationships with OSAT partners to align and implement SiTimes packaging roadmap. Build and manage local teams at key OSAT sites to accelerate development velocity and transfer to production. Manage key issues and risk burn down in the design NPI qualification and volume phases. Develop yield improvement and supply increase plans.
• Mechanical Design:Oversee design analysis and characterization for fit thermal performance structural stability die stress vibration immunity and manufacturability.
• Electrical Interface Optimization:Collaborate with IC design teams to optimize parasitic capacitance resistance and signal integrity.
• Advanced Material Characterization:Drive selection and qualification of substrates die-attach materials underfills and mold compounds in alignment with suppliers.
• Packaging Laboratory:Drive workflows to accelerate screening of alternative materials and characterization of package performance and reliability.
• Productivity:Define best practices and manage KPI metrics for all aspects of package development process and package lifecycle.
• Team Leadership:Track record of talent and leadership development of engineers and technicians to create high-performance execution-focused teams.

Qualifications & Requirements:

• Education:Ph.D. or Masters degree in Mechanical Engineering Materials Science Microelectronics or Physics.
• Experience:10 years of experience in semiconductor packaging R&D with at least 5 years leading teams focused on advanced heterogeneous integration.
• Technical Depth:Expertise in semiconductor materials process integration process engineering and metrology. Develop workflows with EDA tool chains and calibrating measurements to attain predictive performance. Implement automated process control strategies to ensure volume manufacturability and quality.
• OSAT/Foundry Management:Demonstrated expertise in collaborating with OSATs and semiconductor foundries. Understand differences between different supplier capabilities to establish an OSAT-specific execution framework.
• Global Teams:Experience in managing high-performance geographically distributed teams with centers of excellence local decision autonomy and strong teamwork.
• Leadership:Strong cross-functional leadership problem-solving and communication skills.

Desired Characteristics & Attributes:

• Strategic technology leader with the ability to define a differentiated packaging vision and translate it into executable roadmaps milestones and measurable business outcomes.
• Deep technical curiosity and innovation mindset with a demonstrated drive to challenge conventional packaging approaches and solve complex thermal mechanical materials and manufacturability problems.
• Hands-on technical credibility; able to engage at depth with engineers suppliers OSATs and executives while balancing architecture execution quality yield and cost tradeoffs.
• Strong collaborator and influencer who can align cross-functional teams across MEMS IC design process technology product engineering operations quality and external partners.
• Global leadership capability including success building and leading high-performing teams across the U.S. Taiwan and partner locations with clear accountability and strong operating cadence.
• Partner-development mindset with the ability to build trusted technically rigorous relationships with OSATs foundries equipment vendors and materials suppliers.
• Execution-oriented problem solver who thrives in ambiguity drives rapid issue resolution and applies structured root-cause analysis to reduce technical and program risk.
• Customer and product impact orientation with an understanding of how packaging choices affect system performance reliability manufacturability supply resilience and competitive differentiation.
• High standards for engineering discipline including data-driven decision-making robust qualification methods design-for-manufacturing process control and continuous improvement.
• Talent builder and coach who attracts develops and retains exceptional technical talent while creating a culture of ownership collaboration innovation and accountability.
• Entrepreneurial and resourceful mindset comfortable operating in a fast-paced growth environment where priorities evolve and leaders are expected to move from strategy to hands-on problem solving.
• Clear executive communicator able to simplify complex technical topics articulate tradeoffs and influence decisions with senior leadership and external partners.

Compensation Range:

At SiTime we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

The annual base salary range for this role is $238950.00 - $341 710.00. The final offer is determined by factors such as location experience education and training.

In addition to base salary this role is eligible for a quarterly bonus tied to the achievement of innovation goalsreflecting our commitment to recognizing meaningful impact. We also offer equity grants providing a meaningful opportunity to share in the companys future growth and success.

Benefits offered: 401k plan health and wellness that includes medical dental vision life parental leave legal services and time off plans.

SiTime is anEqual Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics including race color religion national or ethnic origin sex sexual orientation gender identity or expression age disability pregnancy political affiliation protected veteran status protected genetic information or marital status or other characteristics protected by law.SiTime participates in theE-Verifyprogram.

Learn More about SiTime:Review theGet to Know SiTimesection of our career page to explore our culture values and what makes us unique.

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