Principal HBM Tapeout Execution & Release Coordination
Richardson, TX - USA
Job Summary
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
Within Microns Heterogeneous Integration Group (HIG) we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI high-performance computing and data-centric applications. Our team collaborates across design product manufacturing and ecosystem partners to deliver innovative memory technologies with exceptional quality and execution excellence.
The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron this role you will drive tapeout execution release readiness and design governance across complex HBM programs partnering with design integration verification and product teams to deliver high-quality designs on schedule.
Responsibilities:
- Lead tapeout execution and release coordination for HBM builds managing schedules DBR achievements and release readiness
- Drive preparation review and completion of tapeout collateral including TOAST RCDB TWIT and related release documentation
- Coordinate signoff readiness across timing power physical verification integration and other release-critical activities
- Ensure database quality completeness traceability and signoff evidence are in place prior to tapeout
- Manage release risks waivers open items and governance processes while maintaining strong release discipline across programs
Minimum Qualifications:
- Bachelors degree in Electrical Engineering or a related field or equivalent experience
- Proven experience with SoC memory or semiconductor tapeout execution and design release processes
- Strong knowledge of DBR processes tapeout checklists release governance and signoff methodologies
- Hands-on experience preparing or reviewing TOAST RCDB TWIT or equivalent tapeout artifacts
- Demonstrated ability to manage release readiness risk tracking and progress in deadline-focused environments
Preferred Qualifications:
- 10 years of relevant semiconductor industry experience
- Experience coordinating cross-functional design verification physical design and product engineering teams through tapeout
- Strong analytical problem-solving and technical decision-making skills with exceptional attention to detail
- Experience with formal program or project management tools and methodologies
- Experience working with Agentic AI tools to assist with design and verification
As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.
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Required Experience:
Staff IC
About Company
Explore Micron Technology, leading in semiconductors with a broad range of performance-enhancing memory and storage solutions