Senior Yield & Integration Engineer

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense factory automation air and water quality environmental monitoring electronics design and development oceanographic research deepwater oil and gas exploration and production medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Job Summary:

Under the general supervision of the Yield & Integration Engineering Manager the Senior Yield & Integration Engineer is a technical leader responsible for driving yield improvement process integration robustness and defectivity reduction across advanced IR detection and thermal imaging device manufacturing operations. This role provides deep expertise in yield analysis failure analysis and progressed materials characterization while leading crossfunctional teams through complex yield excursion investigation technology transfer and new product introductions (NPI).

The individual will need to exhibit a self-driven sense of urgency effective collaboration tolerance of ambiguity and demonstrated ability to exercise objective technical judgement while embracing the following responsibilities:

• Yield Ownership & Defectivity Reduction
  • Oversee wafer foundry yield management by establishing yield monitoring frameworks analyzing inline parametric and final test data to identify yield loss mechanisms
  • Lead root cause investigations into yield excursions across fabrication assembly and test
  • Collaborate closely with foundry partners and internal process integration device and reliability teams to drive corrective actions optimize process windows and deliver sustained yield improvement and cost reduction

• Advanced Failure Analysis & Characterization
  • Analyze yield loss mechanisms impacting key detector metrics
  • Drive root cause analysis using advanced tools and techniques
  • Correlate physical defects to electrical thermal and optical performance impact

• Process Integration IR & Bolometer Technologies
  • Own and optimize integrated process flows
  • Ensure compatibility and robustness across front-end MEMS and back-end processes
  • Support technology transfers and manufacturing ramp of new IR detector designs

• Data Analytics & Performance Correlation
  • Correlate process data with thermal imaging performance metrics and test results
  • Perform advanced yield and performance analysis using JMP Python SQL or MATLAB
  • Develop yield dashboards defect Pareto analyses and predictive indicators for yield risk

• CrossFunctional Technical Leadership
  • Partner closely with device design and modeling teams ROIC and electronics engineering
  • Interact reliability packaging and test engineering
  • Interface with equipment vendors material suppliers and external foundries on yield and integration issues
  • Support customer-facing root cause investigations and continuous improvement efforts

• Mentorship & Continuous Improvement
  • Mentor junior yield and integration engineers in IR-specific failure analysis and yield methodologies
  • Lead multidisciplinary improvement projects using Lean and Six Sigma tools
  • Define best practices documentation standards and yield control plans for manufacturing

The ideal candidate will have the following:

• Technical Expertise
  • Familiarity with electronic circuit functionality (schematics functional elements etc.)
  • Microbolometer MEMS fabrication
  • Insight to wafer foundry functionality and process integration
  • Vacuum technology: concepts materials and equipment
  • Familiarity with photolithography processes and equipment
  • ROIC-to-detector hybridization
  • Wafer bonding dicing and release steps
  • Strong understanding of MEMS processing thin films and wafer-level integration
    • Photolithography
    • Wafer photo pattern strips & cleans
    • CMP Etch Lift-off
    • PECVD PVD E-Beam
  • Expertise in SPC DOE and yield analytics
  • Hands-on experience with AOI SEM EDX FIB FTIR

• Skills
  • Strong data-driven decision-making and mentorship capabilities
  • Exceptional root cause analysis and system-level thinking
  • Strong written and verbal communication
  • Ability to lead technically across organizations without direct authority

Required Qualifications

• M.S. or equivalent in a STEM field- Will consider work equivalent work experience.
• 7 years of experience in yield engineering process integration or device engineering
• Direct experience with infrared detectors thermal imaging systems microbolometers or MEMS devices
• Must be US Citizen or PERM Resident

Preferred Qualifications

• Familiarity with vacuum packaging wafer bonding and hermetic sealing
• Prior ownership of an IR technology node or product family
• Six Sigma Green Belt or Black Belt certification

Salary Range:

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including but not limited to location local regulations (such as minimum wage) education/training work experience key skills and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws regulations rules and regulatory orders. Our reputation for honesty integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin disability or veteran status age or any other characteristic or non-merit based factor made unlawful by federal state or local laws.