Senior Director, Physical Design & Backend Engineering (HPC)

The Senior Director Physical Design & Backend Engineering is accountable for end-to-end backend execution
across HPC SoC and MCU programs including implementation signoff and convergence from RTL to GDS.
This role leads globally distributed engineering teams and ensures delivery of high-quality silicon on schedule
meeting defined power performance and area (PPA) targets. The role operates at the intersection of execution
technology enablement and organizational leadership driving consistency scalability and reliability across
multiple sites and concurrent programs.

Key Responsibilities
1. End-to-End Backend Execution
Own full lifecycle delivery from RTL through physical implementation signoff and tape-out.
Ensure predictable execution design closure and milestone adherence across all programs.
Drive first-pass silicon success through robust methodologies and execution discipline.

2. Global Team Leadership
Lead and scale large geographically distributed backend engineering teams.
Establish clear accountability performance standards and delivery ownership across sites.
Build organizational capability to support multiple concurrent SoC and MCU programs.

3. PPA and Quality Accountability
Own delivery against defined power performance and area (PPA) targets.
Drive continuous improvement in cost quality and engineering efficiency.
Ensure adherence to quality standards signoff criteria and validation requirements.

4. Technology and Methodology Enablement
Enable adoption of advanced process nodes and associated design methodologies.
Drive improvements in tools flows and engineering practices across implementation and signoff.
Partner with foundries EDA vendors and internal teams to enhance design outcomes.

5. Cross-Functional Collaboration
Partner with architecture RTL DFT methodology and product engineering teams.
Ensure alignment between architectural intent and physical implementation feasibility.
Support program execution through close collaboration with program and product leadership.

6. Organizational Execution and Scaling
Standardize ways of working across global teams to reduce variability and improve predictability.
Drive data-driven execution using metrics KPIs and performance tracking.
Identify and remove bottlenecks impacting delivery timelines or quality

 

Qualifications :

Experience
Approximately 20 years of experience in semiconductor design with strong focus on physical design and
implementation.
Proven experience leading large-scale global engineering teams.
Demonstrated track record of delivering complex SoC programs across multiple technology nodes.

Technical Expertise
End-to-end RTL-to-GDSII flow including synthesis place and route timing closure and physical
verification.
Advanced node implementation and signoff methodologies.
Deep understanding of SoC and MCU design and integration.

Leadership Capabilities
Ability to lead large globally distributed teams in a matrixed environment.
Strong execution focus with accountability for delivery outcomes.
Effective cross-functional collaboration and stakeholder management.
Data-driven decision-making and structured problem-solving.

Preferred Qualifications
Experience in high-performance computing automotive or advanced SoC domains.
Exposure to methodology and flow development at scale.
Experience working across multiple geographies and cultures.

Key Success Measures
On-time delivery of silicon across programs.
Achievement of PPA and quality targets.
Improvement in execution predictability and cycle time.
Organizational scalability and capability development.

Additional Information :

Scope and Impact
Responsible for backend execution across multiple SoC and MCU programs.
Direct leadership of large multi-site engineering teams.
Critical impact on silicon delivery timelines product quality and business outcomes.
Key contributor to organizational execution capability and scalability within HPC.

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time