Program Engineer- Fabrication

Posting Description

PROGRAM ENGINEER FABRICATION to support the Technical Concierge Service of the Northeast Microelectronics Coalition (NEMC) Hub. This role combines expert-level technical matchmaking cross-facility coordination hands-on microfabrication and characterization work; will help translate early-stage concepts into manufacturable processes by connecting users with the most appropriate facilities expertise and resources across the regional microelectronics ecosystem; serve as a key interface between academic researchers industry partners government organizations and startups ensuring efficient Lab-to-Fab translation and play a critical role in strengthening the regional microelectronics ecosystem enabling researchers and innovators to rapidly access the infrastructure and expertise required to move ideas from concept to manufacturing.

A full job description can be found here:

Job Requirements

REQUIRED: Bachelors degree in electrical engineering materials science applied physics microelectronics or a related field; a minimum of seven years of related experience in a research environment (including graduate student experience); handson experience with two or more microfabrication processes (e.g. lithography etching deposition packaging or device processing & testing); experience with materials or standard device metrology techniques relevant to microelectronics; strong ability to evaluate technical problems and propose practical experimental or fabrication pathways; and excellent communication skills and ability to work with multidisciplinary teams across academia and industry. PREFERRED: PhD in a related field; experience working in shared research facilities or user laboratories; experience developing SOPs or training materials; familiarity with semiconductor device fabrication heterogeneous integration or advanced packaging; and knowledge of regional and national microelectronics infrastructure networks.

This is a one-year appointment with potential for extension based on funding.

6/5/2026