Photonics Mechanical Design Engineer, Senior

Company Overview:

MACOM designs and manufactures semiconductor products for DataCenter Telecommunication and Industrial and Defense in Lowell Massachusetts MACOM has design centers and salesoffices throughout North America Europe and Asia. MACOM is certified to theISO9001 international quality standard and ISO14001 environmental managementstandard.

MACOM has more than 75 years of application expertise withmultiple design centers Si GaAs and InP fabrication manufacturing assemblyand test and operational facilities throughout North America Europe andAsia. See our website to view our addition MACOM offers foundry services that represents a key corecompetency within our business.

MACOM sells and distributes products globally via a saleschannel comprised of a direct field sales force authorized sales representativesand leading industry distributors. Our sales team is trained across all of ourproducts to give our customers insights into our entire portfolio.

Job Title: Photonics Mechanical Engineer Senior

Position Overview:Technical lead supporting new product introductions from concept through production release. This individual will provide critical design input to RF and/or photonics product and design engineers for optimum cost-effective mechanical solutions. This individual may be required to lead multiple product development projects in parallel to deliver opto-mechanical package and enclosure solutions (modules) on schedule for prototyping and manufacturing.

KeyResponsibilities:

• Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development.
• Work with internal Product Design QA Reliability Supply chain and external suppliers to develop apply and qualify the appropriate packaging technologies and assembly processes with focus on cost manufacturability yield and quality.
• Work with Design Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
• Collaborate with vendors and internal engineering resources to establish and update design rules for packaging.
• Perform design reviews to ensure adherence to DFM guidelines.
• Establish and implement robust assembly processes internally and at contract manufacturers.
• Working with Quality organization characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects then define and implement solutions.
• Design/Develop tooling for high volume high mix processes.
• Establish application notes for new products.

KeyCompetencies & Skills required:

• Knowledge of high-volume RF and photonics packaging assembly/test processes.

• In depth understanding of a variety of optical networking devices such as lasers modulators detectors WDM optical fibers and control electronics.
• Experience in successfully driving design/development/characterization activities from concept to implementation.
• Ability to lead independent process development efforts and provide suppliers direction by working with design assembly and quality organizations.
• Experience with solving steady state and dynamic thermal and mechanical problems using finite element analysis (FEA) and computational fluid dynamics (CFD) software.
• Knowledge of product characterization testing quality and reliability including compliance testing and certification.
• Experience in process troubleshooting failure analysis and Six Sigma methodologies.
• Ability to work under tight deadlines with strong ownership of projects.
• Ability to work effectively in a multi-project mode.
• Good written and verbal communication skills. Able to present ideas design concepts data and plans with high confidence at team meetings and business group review meetings.
• Good teamwork skills in working together to achieve goals.
• Experience with AutoCAD and/or SolidWorks is desired.
• Fluent with Microsoft Office products.

RequiredQualifications and Experience:

• MS or BS in Mechanical Engineering or similar studies.
• Minimum of 10 years of experience in relevant design engineering with process development and design/emphasis on electronic assemblies.
• Due to ITAR regulations onlycandidates who are U.S. Persons (U.S. citizens U.S. nationals lawfulpermanent residents or individuals granted asylum or refugee status) will beconsidered for this position.
• Must be able to obtain a security clearance.
  

The Salary Range for this position is $85000-$120000. Actualsalary offered to candidate will depend on several factors including but notlimited to work location relevant candidates experience education andspecific knowledge skills and abilities.
Benefits: Thisposition offers a comprehensive benefits package including but not limited to:

• Health dental and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.
• This position is eligible toreceive restricted stock unit (RSU) awards and cash bonuses solely at MACOMsdiscretion subject to individual and company performance.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverseworkforce. MACOM will not discriminate against any worker or job applicant onthe basis of race color religion sex gender identity sexual orientationnational origin age disability genetic information veteran status militaryservice marital status or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonableaccommodations to qualified individuals with physical and mental disabilities. Ifyou have a disability and are in need of a reasonable accommodation withrespect to any part of the application process please call 1- oremail Provide your name phone number and the position titleand location in which you are interested and nature of accommodation neededand we will get back to you. We also work with current employees who request orneed reasonable accommodation in order to perform the essential functions oftheir jobs.

Required Experience:

IC