MEMS Semiconductor & Assembly Process Engineer

SUMMARY

Under the direct supervision of the Wafer Management Director the MEMS Semiconductor and Assembly Process Engineer is responsible for the MEMS sensor die from wafer fabrication through wafer-level packaged and tested die. This fab-less role involves working with multiple external suppliers and spans front-end MEMS processes (thin-film deposition lithography metallization etch and release) and back-end assembly (wafer-level hermetic vacuum sealing/bonding wafer probing dicing die attach and wire bonding). Working with suppliers the engineer will sustain and improve yield on production processes develop new processes and tools and qualify them for production manufacturing. The position operates in both cleanroom and non-cleanroom manufacturing environments supporting Production and Engineering.

RESPONSIBILITIES

• Own and sustain MEMS fabrication processes (PECVD/sputter deposition photolithography DRIE and wet etch sacrificial release) to yield Cpk and cost targets.
• Develop and qualify assembly and packaging processes: wafer-to-wafer bonding getter activation and vacuum sealing dicing die attach and wire bonding.
• Characterize bond interfaces and package hermeticity using SAM IR microscopy SEM/FIB cross-sections and long-term vacuum-integrity monitoring.
• Design and run DOEs; use SPC and statistical analysis (JMP Python) to identify drivers of yield loss and drive corrective and preventive actions.
• Manage outsourced process steps at external suppliers: define specifications review vendor data run qualification lots and disposition non-conforming material.
• Perform root-cause failure analysis; drive containment and permanent fixes through the MRB/CCB process.
• Partner with device design test reliability quality and engineering functions on new-product introduction and design-for-manufacturability reviews.

Qualifications :

• BS in Electrical/Mechanical Engineering Materials Science Physics or related field; MS preferred.
• 5 years of hands-on process engineering in MEMS or semiconductor wafer fab with at least 2 years covering assembly/packaging (wafer bonding die attach wire bond or hermetic sealing).
• Working knowledge of thin-film and etch processes and their interaction with downstream packaging (stress outgassing surface preparation for bonding).
• Demonstrated use of DOE SPC and FMEA in a production environment.
• Comfortable in a cleanroom (gowning required); able to read metrology and failure-analysis data and act on it.
• Clear written and verbal communication with suppliers vendors operators and cross-functional engineers.
• Occasional travel to suppliers and contract manufacturers.
• U.S. Person status as defined by ITAR (if required by product line).

PREFERRED QUALIFICATIONS

• Experience with microbolometers or other vacuum-packaged MEMS infrared sensors.
• Wafer-level packaging experience.
• Knowledge of and experience with anti-reflective coatings.
• Wafer defect identification and corrective action to improve yield.
• Familiarity with MEMS reliability test methods.
• Experience managing external foundry and supplier relationships.
• Python or LabVIEW scripting for data handling; ISO 9001 quality-system experience.

Additional Information :

Why Join Seek Thermal
Youll join a high-performing collaborative accounting team where youll have the opportunity to build a broad accounting skill set while learning from experienced team members.

Our team values accuracy accountability continuous improvement and working together to get things done well. We encourage people to ask questions bring forward ideas and understand the why behind their work.

As Seek Thermal grows we want this role to grow with it. Our goal is to provide the mentorship experience and increasing responsibility needed to develop into a well-rounded accounting professional.

Our Story 
The company was founded in 2012 by two industry pioneering scientists Bill Parrish PhD and Tim Fitzgibbons PhD who spent 40 years advancing the state of military and professional-grade thermal imaging technology. Following their previous two companies Amber Engineering and Indigo Systems each with successful acquisitions Seek Thermal is their third venture with the mission to make thermal imaging a part of everyday life.
An unseen world of energy surrounds us. We only see some of it with our eyes light from a source of energy reflected on objects around us. But even though we cant see it all objects produce or retain heat. When viewed through a Seek Thermal camera this world of heat can be converted to images providing important information useful in solving everyday problems that are otherwise invisible to the naked eye. Seek thermal imaging lets you see the world of heat instead of the world of light.
Seek Thermal is partnered with Raytheon and NXP to design and deliver high-quality affordable thermal imaging sensors and products across the globe at scale.  As one of the few companies in the world capable of building sensors Seek Thermal has shipped hundreds of thousands of thermal imaging products around the world as it continues to make thermal imaging an accessible everyday tool so people can do their jobs safer faster and smarter.

Remote Work :

No

Employment Type :

Full-time