Mechanical FEA Engineer

Job Title: Mechanical FEA Engineer
Job Location: Fremont CA
Interview: Virtual
Job Duration: 6 Months

Responsibilities:

• Perform static structural Finite Element Analysis (FEA) for hardware accelerator modules focusing on stiffener design rib layouts thickness geometry mounting locations and material selection.
• Analyze mounting pressure gravity sag and handling load conditions to evaluate structural performance.
• Conduct random vibration sine sweep shock and drop simulations to assess hardware reliability during transportation and operation.
• Perform modal analysis and evaluate fatigue yield and structural failure risks.
• Execute PCB and PCBA warpage simulations across different assembly stages including bare PCB populated components and complete PCBA at room and elevated temperatures.
• Evaluate thermal expansion (CTE mismatch) assembly effects and package warpage to identify potential SMT manufacturing risks.
• Develop simulation models meshing strategies analysis plans and detailed technical reports.
• Validate simulation results against physical testing including shadow-moiré measurements shaker testing and drop testing.
• Refine FEA models based on test correlation and report results against defined acceptance criteria.

Must Haves:

• 5 years of hands-on structural FEA experience in electronics PCB/PCBA or semiconductor packaging.
• Strong experience with ANSYS and/or Altair HyperMesh for structural simulation and analysis.
• Hands-on experience with PCB/PCBA warpage simulation including thermal expansion CTE mismatch and assembly/reflow effects.
• Experience performing shock vibration drop modal and fatigue analysis.
• Strong understanding of mechanical stress strain deformation and structural reliability.
• Experience correlating simulation results with physical test data and refining analytical models.
• Ability to independently execute defined simulation load cases and prepare technical reports against acceptance criteria.

Nice to Haves

• Experience supporting server hardware AI accelerator modules or advanced electronic packaging.
• Familiarity with SMT processes and package-level warpage evaluation.
• Experience with shadow-moiré testing and mechanical reliability validation.
• Knowledge of thermal-mechanical interactions in electronic assemblies.
• Experience working with hardware design manufacturing and testing teams.

Required Skills:

ANSYS