EtchSRP SBU Product Line Manager (TPM)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

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What Youll Do

The Etch Service Business Unit develops innovative service products and solutions that help semiconductor manufacturers improve productivity tool performance uptime and cost of ownership across a global installed base. Our team works at the intersection of engineering systems integration operations data and field execution to solve complex technical challenges and deliver measurable customer value. This is a highly collaborative environment where technical depth cross-functional leadership and customer focus are essential to success.

We are seeking a strong Technical Program Manager / Systems Engineering leader to drive service product development for Applied Materials Etch Service Business Unit (SBU). This role is responsible for leading complex cross-functional programs that improve tool productivity uptime matching and on-wafer performance across the semiconductor installed base. The ideal candidate brings deep systems engineering expertise a strong track record in technical program execution and the ability to integrate hardware software analytics and service readiness into scalable customer solutions. This leader will work across business units engineering operations and field teams to deliver high-value service products that meet customer requirements and business objectives.

Responsibilities

• Lead end-to-end technical program management for service product development initiatives supporting Etch chambers and subsystem solutions.
• Own cross-functional program execution across engineering product operations supply chain analytics and field service teams to deliver integrated high-value service offerings.
• Apply systems engineering expertise to define requirements manage technical tradeoffs and integrate electrical mechanical software physics algorithms and data capabilities into scalable service products.
• Drive program planning milestone management risk mitigation and executive communication throughout the product development and release lifecycle.
• Partner with equipment business units and cross-functional teams to ensure service readiness including spares training Design for Install (DfI) Design for Service (DfS) Design for Automated Service (DfAS) and data infrastructure.
• Develop service product roadmaps aligned to customer technology inflections voice-of-customer inputs and business priorities.
• Define and align critical system parameters data requirements and product performance metrics with business unit and engineering stakeholders.
• Ensure field scalability and deployment readiness by driving training documentation operational support models and manufacturing and repair pathways for newly developed service products.
• Own cost performance and reliability targets including Cost of Ownership (CoO) MTTR MTBC productivity and serviceability metrics.
• Collaborate with data science and engineering teams to develop and validate predictive and AI-enabled service solutions that improve customer outcomes and product value.
• Support new product introduction (NPI) and concurrent development activities by ensuring alignment on requirements service design and data strategy during the development cycle.

Desired Skills Competencies Experience & Education

• Bachelors or Masters degree in Engineering Physics Materials Science or a related technical field.
• 15 years of relevant experience in semiconductor equipment systems engineering technical program management product development or process development.
• Demonstrated success leading complex cross-functional technical programs from concept through release and deployment.
• Strong systems engineering background with experience integrating hardware software data and service workflows into end-to-end solutions.
• Deep semiconductor domain expertise with experience in plasma etch deposition materials engineering or semiconductor equipment systems preferred.
• Experience with new product introduction (NPI) service readiness and field deployment in a high-technology environment.
• Strong customer orientation with the ability to translate voice-of-customer and market needs into technical requirements and program priorities.
• Proven ability to drive decisions influence stakeholders and communicate effectively with engineering operations product finance marketing and executive leadership.
• Experience managing product cost reliability serviceability and KPI-based business outcomes.
• Strong analytical organizational and project management skills with the ability to lead multiple priorities in a fast-paced environment.

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

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