Copy of Director, Package Design Engineering

Responsibilities:

• Package Technology Development/NPI R&D Global OSAT management for new Package Development/Product qualification Technology Roadmap definition R&D budget management & customer adoption programs.
• Focus on design and development of package and interconnect methods for Renesass AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages Vertical Power Stages Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC AMB substrates and advanced interconnect technologies. Knowledge of wafer level flip-chip multi-chip module and power devices will be a plus.
• Benchmark select and qualify suitable materials processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitors to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complaints working with peers of Marketing Product groups Quality and Operations organization to satisfy growth in businesses.
• Establish & maintain package design rules.

Qualifications :

Qualifications:

• Doctorate/Masters / Bachelors Degree in Physics Chemistry Mechanical Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module wafer level & flip-chip packaging
• Strong understanding of power SiP/modules wafer level/flip-chip packaging methods assembly process knowledge qualification methods SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. With a global team of over 21000 engineers and problem solvers in more than 30 countries we offer the opportunity to work on worldleading technology for Automotive Industrial Infrastructure and IoT shaping a safer healthier greener and smarter future.

At Renesas TAGIE is our culture grounded in being Transparent Agile Global Innovative and Entrepreneurial. It shapes how we work grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time