Enter a job title or keyword
Advanced Packaging Development Engineer
Job Location:
Job Location:
Santa Clara County, CA - USA
Monthly Salary:
Not provided by the employer
Monthly Salary:
Posted:
13 November 2026 (6 hours ago)
Posted:
Application Deadline:
10 February 2027
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
Apples Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future this role you will lead the definition development and qualification of cutting-edge 2.5D and 3D packaging technologiesincorporating features such as hybrid bonding high-density interposers fine-pitch microbumps and Through-Silicon Vias (TSVs).nnYou will work cross-functionally with silicon design physical design SI/PI thermal and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.
In this role you will be responsible for advanced package integration and technology development within a cross-functional team driving novel 2.5D/3D architectures from early concept through qualification.
Develop Advanced Packaging Architectures: Lead the definition development and qualification of advanced packaging technologies featuring hybrid bonding fine-pitch microbumps interposers and u0026 Execute Test Vehicles: Design experimental test vehicles establish packaging design rules and lead characterization to validate novel interconnect concepts and build confidence for product Chip-Package Interaction u0026 Reliability: Assess CPI risks correlate mechanical and thermal stress behaviors and partner with failure analysis teams to resolve yield material and structural Cross-Functional Co-Optimization: Collaborate across architecture silicon design SI/PI and thermal teams to evaluate holistic system trade-offs across performance power reliability and External Technology Partners: Direct foundry and OSAT partners on technology roadmaps process capability targets development schedules and high-volume manufacturing ramp.
Bachelors degree required
Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding interposers fine-pitch microbumps and TSVs).nSolid grasp of fab BEoL/MEoL interconnect processing wafer-level packaging and advanced assembly of packaging materials thermo-mechanical reliability and chip-package interaction failure systems mindset with the ability to balance package-level choices against silicon electrical thermal and manufacturing utilizing layout physical design or modeling tools alongside engineering data track record collaborating with and driving external foundries OSATs or material communication and collaboration skills across cross-functional hardware u0026 ExperiencenDegree: B.S. M.S. or Ph.D. in Physics Materials Science Electrical Engineering Mechanical Engineering Computer Engineering or a related technical discipline.
In this role you will be responsible for advanced package integration and technology development within a cross-functional team driving novel 2.5D/3D architectures from early concept through qualification.
Develop Advanced Packaging Architectures: Lead the definition development and qualification of advanced packaging technologies featuring hybrid bonding fine-pitch microbumps interposers and u0026 Execute Test Vehicles: Design experimental test vehicles establish packaging design rules and lead characterization to validate novel interconnect concepts and build confidence for product Chip-Package Interaction u0026 Reliability: Assess CPI risks correlate mechanical and thermal stress behaviors and partner with failure analysis teams to resolve yield material and structural Cross-Functional Co-Optimization: Collaborate across architecture silicon design SI/PI and thermal teams to evaluate holistic system trade-offs across performance power reliability and External Technology Partners: Direct foundry and OSAT partners on technology roadmaps process capability targets development schedules and high-volume manufacturing ramp.
Bachelors degree required
Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding interposers fine-pitch microbumps and TSVs).nSolid grasp of fab BEoL/MEoL interconnect processing wafer-level packaging and advanced assembly of packaging materials thermo-mechanical reliability and chip-package interaction failure systems mindset with the ability to balance package-level choices against silicon electrical thermal and manufacturing utilizing layout physical design or modeling tools alongside engineering data track record collaborating with and driving external foundries OSATs or material communication and collaboration skills across cross-functional hardware u0026 ExperiencenDegree: B.S. M.S. or Ph.D. in Physics Materials Science Electrical Engineering Mechanical Engineering Computer Engineering or a related technical discipline.
Required Experience:
IC
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
