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Advanced Package Development Engineer
Job Location:
Job Location:
Austin, TX - USA
Monthly Salary:
Not provided by the employer
Monthly Salary:
Posted:
3 July 2026 (30+ days ago)
Posted:
Application Deadline:
30 September 2026
Application Deadline:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
Join the team behind the technology in a billion pockets worldwide. Apples Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation this role youll contribute to the advanced packaging technologies that enable Apples industry-leading silicon performance. Youll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology looking for someone who:n Has deep expertise in semiconductor packaging or related disciplinesn Thrives on solving difficult technical problemsn Holds themselves to a high standard of engineering excellencen Is self-motivated and comfortable navigating ambiguity
Develop and qualify advanced packaging technologies including substrate design interconnect architectures and assembly processes to meet performance power and form factor requirements for next-generation package integration across silicon firmware and system teams to ensure co-optimization of die architecture package design and thermal/mechanical characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective with external suppliers and foundries to evaluate new materials and processes establish specifications and enable technology transfer to high-volume and execute test vehicles and experiments to validate packaging concepts establish design rules and generate data for product design decisions.
BS and 10 years of experience in relevant industry experience.
PhD and 6 years of experience in relevant industry fab interconnect process integration experience in BEoL process RDL fine pitch μ-bumps hybrid bonds TSVs knowledge of electrical mechanical and thermal properties of fab expertise in Si Fab equipment and Fab Logistics on advanced packaging for groundbreaking CMOS on Si structure yield and reliability mechanisms and familiarity with electrical mechanical and/or thermal characterization failure experience: One or more of TCAD JMP Virtuoso KLayout Ansys of independent Ru0026D Work in a cross-functional team driving communication in Si fab integration role and advanced packaging.
Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology looking for someone who:n Has deep expertise in semiconductor packaging or related disciplinesn Thrives on solving difficult technical problemsn Holds themselves to a high standard of engineering excellencen Is self-motivated and comfortable navigating ambiguity
Develop and qualify advanced packaging technologies including substrate design interconnect architectures and assembly processes to meet performance power and form factor requirements for next-generation package integration across silicon firmware and system teams to ensure co-optimization of die architecture package design and thermal/mechanical characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective with external suppliers and foundries to evaluate new materials and processes establish specifications and enable technology transfer to high-volume and execute test vehicles and experiments to validate packaging concepts establish design rules and generate data for product design decisions.
BS and 10 years of experience in relevant industry experience.
PhD and 6 years of experience in relevant industry fab interconnect process integration experience in BEoL process RDL fine pitch μ-bumps hybrid bonds TSVs knowledge of electrical mechanical and thermal properties of fab expertise in Si Fab equipment and Fab Logistics on advanced packaging for groundbreaking CMOS on Si structure yield and reliability mechanisms and familiarity with electrical mechanical and/or thermal characterization failure experience: One or more of TCAD JMP Virtuoso KLayout Ansys of independent Ru0026D Work in a cross-functional team driving communication in Si fab integration role and advanced packaging.
Required Experience:
IC
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
