09-Senior Lead Engineer, Manufacturing Process

Functional Area: Engineering
Career Stream: Process Engineering Manufacturing
SAP Short Name: SLE-ENG-PRM
Job Level: Level 09
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect

Why Celestica

Celestica is changing the future! We are imagining developing and delivering a better future with our customers.

At Celestica we foster a motivated high-integrity work environment based on a strong set of corporate Values. These Values empower our employees to provide you with superior service.

Relentless Curiosity

We are obsessed with uncovering the information and insights that allow us to anticipate and overcome the challenges of the future.

Bold Conviction

We dare to envision new solutions new technologies new ways of working and invest to make it a reality.

Unwavering Dedication

We exemplify teamwork and commitment in every decision and every action to be the best partners to our customers and our colleagues.

The Senior Lead Engineer - Manufacturing Process is responsible for designing developing deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

• Performs tasks such as but not limited to the following:

• Responsible for understanding and implementing the customers technical roadmap and related process development projects.
• Lead and implement the development and release of the full manufacturing process for new customer products.
• Understand and provide feedback on customers technical requirements to team members and management
• Responsible for developing and implementing costed and optimized feedback using Design for manufacturability (DFX) tools and processes with the goal of reducing manufacturing cost and improving quality and reliability of product.
• Develop plan and lead the assessment of the capability of process applications using Design of Experiments.
• Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield reliability and diagnoses to root causes failures impacting product quality.
• Ensure accurate and timely communication to management on critical technical and business issues.

• NPI-PCBA: ESD Component Prep Laser marking Solder Paste Deposition (screening / jetting) / Stencil Design SMT component placement Reflow Tooling design PTH soldering PTH manual assembly Press Fit assembly Depanelization Board level mechanical assembly wire harness assembly wire prep SMT data analytics SMT / PTH manual / automated rework cleaning processes coating / potting underfill / ruggedization processes pack & ship optical component assembly fiber / tray handling processes fiber splicing IPC-610 quality data (KPI) Engineering Control & System Tools (ODC/SCE) Manufacturing Operational management DFM - Mfg DFA DFR Customer specific processes structural test and inspection processes machining welding CNC programming secondary processes sheet metal DFAA.
• DFX: ESD Controls Component Prep Component Module Programming Laser Marking Screening Stencil Design Solder Paste Dispense / Jetting SMT Programming SMT Placement SMT Reflow Sweat Soldering Flex Board Assembly / Handling Pallet Design PTH Soldering Robot Soldering PTH manual Assembly PTH Auto Assembly Pressfit Depanelization Mechanical Assemb;y (TIMs Heatsinks PCBA Hotbar Ultrasonic Welding) Wire Harness Assembly Wire Prep System Assembly SMT and PTH Rework Cleaning Processes Conformal Coating Underfills / Edgebonding / Potting Pack and Ship Chassis Assembly (fluidics electrical enclosure cable routing) Sheet Metal Machining Welding Structural Test (API AOI AXI ICT Flying Probe)
• FA LAB: ESD Controls Solder Metallurgy Strain Gauge Analysis SIR Testing Solder Joint Reliability Modeling Sample Prep (Grind and Polish) Dye & Pry CMM/VMM Lab X-Ray Pull/Bend Testing Vibration Testing Drop Testing TDR XRF SEM FTIR IC Solderability Testing Thermal Analysis HALT/HASS TH&B Thermal Shock ATC
• OPTICAL & XRAY INSPECTION: ESD Controls Auto Wire Prep SMT Data Analytics API AOI (PCBA) AXI (PCBA) AOI (System) Test Strategy Creation IPC-610 Quality Dat (KPI) DFM - Manufacturing DFA - Assembly DFT / Physical Test DFT - Electrical Test
• MACHINING & OTHER: ESD Controls Pack & Ship CNC programming Secondary Processing Sheet Metal Machining Welding DFM - Manufacturing
• MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls Wire Harness Assembly Auto Wire Prep Mechanical Assembly - System Build OEE / Industrial Engineering Pack & Ship Vacuum System Fluidics Electrical Enclosure Cable Routing Electrical - Automation Mechanical - Automation Machine Vision IPC-610 Engineering Controls Quality Data (KPI) Manufacturing Operational Management DFM - Manufacturing DFA - Assembly DFAA - Automated Assembly DFT - Physical Test
• PCBA ASSEMBLY: ESD Component Prep Laser marking Solder Paste Deposition (screening / jetting) / Stencil Design SMT component placement Reflow Tooling design PTH soldering PTH manual assembly Press Fit assembly Depanelization Board level mechanical assembly wire harness assembly wire prep SMT data analytics SMT / PTH manual / automated rework cleaning processes coating / potting underfill / ruggedization processes pack & ship optical component assembly fiber / tray handling processes fiber splicing IPC-610 quality data (KPI) Manufacturing Operational management DFM - Mfg DFA DFR Customer specific processes.
• MICROELECTRONICS: ESD Controls Wafer Thinning Wafer Singulation Edge Polishing Optical Coatings Die Bonding Vacuum Reflow Flip Chip Bonding Underfill Active Alignment Plasma Cleaning Wire Bonding Encapsulation Sealing Leak Testing Interconnect Formation

• 4 to 6 years in a similar role or industry.
• Project Management - Ability to manage/lead complex multiple line engineering projects that may also involve other functions. Demonstrate solid understanding of the technical financial and people aspects of the project. Able to create a project/change management plan and ensure that the project is delivered within the assigned time and budget. Ability to recognize project barriers and develop mitigation plans.
• Leadership - Demonstrate People & Team Leadership Behaviors as per Celestica Leadership Imperatives.
• Financial Acumen / Business Planning - Ability to create financial plans for your projects align them internally with your line of management and other functions and externally if needed. Create project plans profitability calculations risk and sensitivity analysis able to recognize barriers and mitigate profitability risks. Fully knowledgeable about internal and external financial reporting accounting and tax requirements relevant to your area of expertise.
• Coaching/Mentoring Communication/Negotiation/Presentation Creative Problem Solving Customer Interaction/Stakeholder Management Quality & Lean Working Effectively with Others D/PFMEA 8D/Corrective Action Equipment Safety Design of Experiments (DOE).

Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
• Repetitive manual movements (e.g. data entry using a computer mouse using a calculator etc.) are frequently required.
• Occasional travel may be required.