Service & Support Manager
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Job Summary
About the Role
Our client a global supplier of high-precision die bonding and micro-assembly equipment is building out its APAC service capability from its new Thailand office and is seeking a Service & Support Manager to lead technical service and customer support across Thailand and the wider APAC region.
This is a senior role with regional ownership suited to an experienced service leader from semiconductor equipment precision automation or a comparable high-tech environment.
Key Responsibilities
- Define and execute the service strategy for Thailand and APAC aligned with global service standards
- Track and improve service KPIs including response times resolution rates and customer satisfaction
- Plan resourcing and engineering capacity across the region
- Manage customer escalations ensuring rapid resolution and clear stakeholder communication
- Coordinate with headquarters on technical issues product feedback and field engineering matters
- Oversee spare parts management tooling and field support logistics
- Drive process improvements across the service function
- Lead mentor and develop the regional technical service team
What Were Looking For
- Proven experience managing technical service or field service operations ideally within semiconductor equipment or comparable capital equipment industries
- Strong people management and team leadership track record
- Solid technical foundation with an engineering degree or equivalent experience
- Customer-first mindset with strong escalation management skills
- Familiarity with KPI-driven service operations and process improvement methodologies
- Good English communication skills both written and spoken
- Willingness to travel within Thailand and APAC
- Must be eligible to work in Thailand
Whats On Offer
- 16 days annual leave
- Performance bonus
- Group health insurance
- Travel allowance
Logistics
- Pathum Thani
- A private car is preferred due to the office location
- Full-time permanent role
About the Company
Our client is a global supplier of high-precision die bonding and micro-assembly equipment supporting semiconductor photonics and advanced packaging applications for over 30 years. With subsidiaries on three continents they deliver local expertise and long-term technical collaboration worldwide.
