Advance Packaging Process Development Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

JOB DESCRIPTION:

Microns Assembly PackageProcessDevelopment team is looking for a motivated and experienced individual contributor for this position inProcessDevelopment team.A good candidatewill be developingconfiguringandoptimizingPackage Assembly processes (front endbondingand back end) for Microns memoryproductsrampupincludingside by sidecertificationwith Manufacturing teams. Assessing processes by knowledge and skills taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assemblyprocess guidelinerules workingcloselywith Design teams (Globally) and you will be involved in the runningtestingand upgrading systems and processes approving the materialsprocessand equipment changes in the CCB (change control board).Animportance of this roleisprocesscapabilityof innovative package technology: Deep fundamental understanding of the key risks inBumpingTSV (Through-Silicon Via) packagingtechnologies. Actual experience withTCB(Thermal Compression Bonding) CMP (Chemical Mechanical Polish) and Ball Mountis aplus. Finallyhands onintegration experience inPackageAssembly andWafer Levelpackage processareneeded.

JOB REQUIREMENT

• 0-2 years of experiencein semiconductor manufacturing or a related field with hands-on experience in semiconductor packaging or Frontend processes. Experience with High Bandwidth Memory (HBM) integration is a plus.

• Education:Bachelor degree in Electrical Engineering Mechanical Engineering Materials Science Chemical EngineeringPhysicsor related is preferred

• Technical Experience: Development experience in one or more areas of Photo Physical Vapor Deposition (PVD)Chemical Vapor Deposition (CVD) Chemical Mechanical Planarization (CMP) wafer level molding wafer level ball mount Thermo-Compression Bonding (TCB) Flip Chip (FC) Underfill (UF) Hybrid bond Glass carrier bond/ de-bondis a plus

• Problem-Solving Abilities: Strong analytical and problem-solving skills with the ability to troubleshoot issues and optimize process parameters.

• Communication Skills:Effective verbal and written communication skills with the ability to communicate clearly and professionally with team members and stakeholders

• Adaptability: Ability to work effectively in a fast-paced and dynamicenvironment with the flexibility to workwithglobal teams across different time zones

• Team Player: Collaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals.

Inclusion & Accessibility Statement

Micron is committed to fair inclusive and meritbased hiring. Reasonableaccommodation isavailable to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.

Values Alignment

Successful candidates are expected to embody Microns core values:

• People Respect develop and empower others
• Innovation Drive continuous improvement and breakthrough thinking
• Tenacity Demonstrate accountability and perseverance
• Collaboration Build trust and work as one team
• Customer Focus Deliver excellence and value

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.

To request assistance with the application process and/or for reasonable accommodationsplease contact at .

Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However all information provided must be accurate and reflect the candidates true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

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