Process Engineer Intern

The Process Engineer Intern will support the development characterization and optimization of thin film deposition processes for advanced semiconductor packaging applications. The intern will work closely with process hardware and materials engineers to conduct experiments analyze data and contribute to new technology development for next-generation semiconductor devices.

This internship provides hands-on exposure to semiconductor manufacturing equipment process development methodologies statistical data analysis and advanced packaging technologies.

• Assist engineers in designing and executing process engineering experiments.
• Support development and optimization of CVD PECVD PEALD or related thin film deposition processes.
• Perform wafer processing and experimental runs according to defined procedures.
• Analyze process results and identify opportunities for performance improvement.

• Collect and analyze process and metrology data.
• Characterize film properties including:
  • Thickness
  • Uniformity
  • Refractive Index
  • Stress
  • Composition
  • Surface Roughness
  • Electrical Properties
• Utilize statistical methods and data visualization tools to identify trends and correlations.
• Film characterization and integration test on AMAT internal test vehicle

• Support troubleshooting of process and equipment-related issues.
• Participate in structured root cause analysis activities.
• Document findings and propose corrective actions.

• Maintain accurate experimental records and engineering logs.
• Prepare technical reports and presentations summarizing findings.
• Present project progress and final internship results to engineering leadership.

• Work with Process Hardware Manufacturing and Product Engineering teams.
• Participate in technical discussions and project review meetings.
• Support customer-focused development activities where appropriate.

Depending on business priorities interns may be assigned projects related to:

• Low-temperature dielectric deposition
• Advanced packaging materials development
• Wafer bonding process optimization
• Gap fill process development
• Film characterization and metrology correlation
• Process hardware characterization
• Process automation and data analytics
• AI-assisted process optimization

• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin film deposition plasma processing or surface science.
• Experience with experimental design and data analysis.
• Strong problem-solving and analytical skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively in a team environment.

By the end of the internship the intern will gain experience in:

• Semiconductor process development methodology
• Advanced packaging technologies
• Experimental design and DOE execution
• Thin film characterization techniques
• Engineering problem solving and root cause analysis
• Technical presentation and communication skills
• Working in a global semiconductor equipment company