Package Design Engineer

Please Note:

1. If you are a first time user please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account please Sign-In before you apply.

Job Description:

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI) networking high-performance computing (HPC) and 5G base stations. These designs include SerDes at 112G and higher RF/Microwave ADC/DAC DDR and more. Youll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs (layout/routing) including aspects of impedance matching crosstalk signal integrity power integrity manufacturability reliability and thermal in partnership with our experienced team of package engineering experts.

• Package Design of critical high frequency/datarate structures for SerDes ADC/DAC DDR etc.

• Schedule prioritize & track your work across multiple projects simultaneously

• General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

• (EE/EEE) or similar field and 5 years experience in flip-chip-BGA package design including high-speed SerDes

• (EE/EEE) or similar field and 3 years experience in flip-chip-BGA package design including high-speed SerDes

• Knowledge of package-level signal integrity and power integrity to apply to package designs

• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

• Cooperate with our world-wide team (multiple time zones) including co-design with internal team members and external (Vendor) designers.

• Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

• (EE/EEE) or similar field and 8 years experience in flip-chip-BGA package design including high-speed SerDes preferred.

• (EE/EEE) or similar field and 6 years experience in flip-chip-BGA package design including high-speed SerDes preferred.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.