Assembly Quality Engineer
Job Location:
Carmona - Philippines
Monthly Salary:
Posted:
Application Deadline:
Vacancies:
Job Summary
Job Summary:
onsemi is looking for an Assembly Quality Engineer who is responsible for ensuring product quality process stability and continuous improvement across Front of Line (FOL) semiconductor assembly operations including Wafer Saw Die Attach/Die Bond and Wire Bond processes. This role drives defect prevention yield improvement customer satisfaction and compliance with quality management system requirements through data analysis problem-solving process audits and collaboration with cross-functional teams.
Responsibilities
- Monitor and analyze quality performance metrics for Wafer Saw Die Bond and Wire Bond processes.
- Lead investigation of assembly-related defects yield excursions customer complaints and manufacturing non-conformances using structured problem-solving methodologies (8D DMAIC 5 Why Fishbone Analysis).
- Implement and verify corrective and preventive actions to eliminate recurring quality issues.
- Drive continuous improvement projects focused on defect reduction process capability improvement yield enhancement and cost of poor quality reduction.
- Review Statistical Process Control (SPC) data process capability indices (Cp/Cpk) and quality trends to identify risks and opportunities for improvement.
- Support qualification and validation activities for new products materials equipment and process changes.
- Conduct process product and system audits to ensure compliance with internal procedures customer requirements and industry standards.
- Partner with Manufacturing and Process Engineering teams to establish robust controls and quality checkpoints.
- Develop and maintain quality documentation including Control Plans PFMEA Inspection Standards and Work Instructions.
- Participate in customer audits and support responses to customer quality concerns and corrective actions.
- Ensure compliance with ISO 9001 IATF 16949 (where applicable) and company quality management system requirements.
- Facilitate containment activities during quality incidents and coordinate disposition of non-conforming materials.
Qualifications
Requirements
- Bachelors Degree in Engineering (Electronics Electrical Mechanical Industrial Materials Science or related discipline).
- Minimum 5 years of experience in semiconductor assembly manufacturing and quality engineering.
- Strong knowledge of Front of Line assembly processes including Wafer Saw Die Attach/Die Bond and Wire Bond.
- Experience in semiconductor quality tools and methodologies such as SPC FMEA MSA Control Plans DOE CAPA and Root Cause Analysis.
- Working knowledge of semiconductor package construction assembly materials and reliability requirements.
- Experience in interpreting engineering drawings specifications and process standards.
- Strong analytical troubleshooting and data interpretation skills.
- Proficiency in quality reporting and statistical analysis tools (Minitab JMP Excel Power BI or equivalent).
- Excellent communication and cross-functional collaboration skills.
Preferred Skills
- Experience supporting automotive semiconductor products and IATF 16949 requirements.
- Knowledge of Lean Manufacturing and Six Sigma methodologies (Green Belt Six Sigma is an advantage).
- Familiarity with Backend process and semiconductor reliability testing.
Required Experience:
IC
About Company
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and ... View more
