Semiconductor Package Competitive Analysis Intern
Job Location:
Job Location:
Kuala Lumpur - Malaysia
Monthly Salary:
Not Disclosed
Monthly Salary:
Posted on:
23 hours ago
Posted on:
Vacancies:
1 Vacancy
Vacancies:
Job Summary
Competitive Analysis Intern Package Innovation
Role Summary
Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies market trends and competitor activities.
Key Responsibilities
- Perform structured data mining of competitor product releases PCNs teardown reports and technology announcements
- Develop insights on packaging trends cost/performance positioning and technology differentiation
- Conduct startup and emerging technology evaluations relevant to advanced packaging
- Consolidate findings into clear executive-ready reports and dashboards for PI leadership
- Maintain and enhance competitive analysis databases and tracking frameworks
Additional Exposure
- Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes
Qualifications
- Degree candidate in Materials Science Mechanical Electrical Engineering or related field
- Strong analytical mindset with ability to synthesize large datasets into actionable insights
- Proficient in Excel and PowerPoint; data analysis or visualization experience preferred
- Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired
- Strong communication skills with ability to clearly present findings
Required Experience:
Intern
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
