Packaging Engineer

TRUMPF

Job Location:

Cranbury, NJ - USA

Monthly Salary: $ 93253 - 112504

Posted on: 16 hours ago

Vacancies: 1 Vacancy

Job Summary

As a family-run high-tech company with nearly 19000 employees at 71 locations worldwide we are looking for forward thinkers with unconventional ideas and drive to join our team. Our company culture which values collaboration and mutual trust creates the ideal framework for boldly trying new things and questioning the status quo. Our technologies inspire people to develop and produce things that are currently unimaginable. Whether lasers machine tools EUV or electronics - TRUMPF is building technological worlds for future generations. Are you ready for new challenges

Join a team pushing the limits of laser technology. As a Packaging Engineer youll own critical processes that turn cutting-edge diode laser devices into production-ready powerhousesdriving performance through precision mounting bonding and interface characterization.

Youll be the go-to expert for key production tools and processes championing uptime stability and continuous improvement while partnering closely with R&D to bring new concepts to life on the factory floor.

What youll do

Own and optimize die bonding and wire bonding processes and tools for highpower diode lasers.
Lead interface characterization and packaging process tuning based on optical KPIs (power voltage slow axis smile placement accuracy etc.).
Take full ownership of production equipment: process control sustaining tool uptime and maintenance troubleshooting.
Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
Lead and contribute to 4D/8D problem-solving and shepherd ECNs including MES/Database updates.
Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.
Use SPC MSA DOE and JMP/Minitab to deliver datadriven process improvements.
Tackle complex equipment and process issues with structured troubleshooting; deliver highquality results on time.
Communicate clearly influence crossfunctional teams and mentor peers while executing welldefined tasks with guidance as needed.

What you bring

BS or MS in Mechanical/Electrical Engineering Materials Science or Physics.
3 years handson with die attach thermocompression bonding wire bonding vacuum reflow and pickandplace.
Manufacturing support experience in lasers or semiconductors (preferred).
Familiarity with K&S or F&K wire bonders and/or SET die bonders (plus).
Strong with JMP Minitab or similar statistical tools; fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).
Proven track record driving crossfunctional issue resolution and leading teams.
Comfortable in a cleanroom environment (gowning required).
Excellent communicator who gives and receives feedback constructively.

Why this role

Impact: Your processes directly shape performance in advanced laser products.
Variety: From sustaining and yield to ECNs and newprocess qualsno two days are the same.
Growth: Work at the intersection of production and R&D with room to lead.

Pay Range: $93253.50 - $112504

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Required Experience:

What youll do

Own and optimize die bonding and wire bonding processes and tools for highpower diode lasers.
Lead interface characterization and packaging process tuning based on optical KPIs (power voltage slow axis smile placement accuracy etc.).
Take full ownership of production equipment: process control sustaining tool uptime and maintenance troubleshooting.
Drive yield improvement and cost reduction initiatives; spot yield excursions fast and implement robust corrective actions.
Lead and contribute to 4D/8D problem-solving and shepherd ECNs including MES/Database updates.
Partner with R&D to industrialize new processes; define qualification plans and specifications for new equipment and methods.
Use SPC MSA DOE and JMP/Minitab to deliver datadriven process improvements.
Tackle complex equipment and process issues with structured troubleshooting; deliver highquality results on time.
Communicate clearly influence crossfunctional teams and mentor peers while executing welldefined tasks with guidance as needed.

What you bring

BS or MS in Mechanical/Electrical Engineering Materials Science or Physics.
3 years handson with die attach thermocompression bonding wire bonding vacuum reflow and pickandplace.
Manufacturing support experience in lasers or semiconductors (preferred).
Familiarity with K&S or F&K wire bonders and/or SET die bonders (plus).
Strong with JMP Minitab or similar statistical tools; fluent in SPC/DOE/Six Sigma/problem solving (certification a plus).
Proven track record driving crossfunctional issue resolution and leading teams.
Comfortable in a cleanroom environment (gowning required).
Excellent communicator who gives and receives feedback constructively.

Why this role

Impact: Your processes directly shape performance in advanced laser products.
Variety: From sustaining and yield to ECNs and newprocess qualsno two days are the same.
Growth: Work at the intersection of production and R&D with room to lead.

Pay Range: $93253.50 - $112504

Required Experience: