Packaging Engineer
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Job Location:
Monthly Salary:
Experience Required:
Posted on:
5 hours ago
Vacancies:
1 Vacancy
Job Summary
- Drive the optimization and establishment of robust high-speed process parameters for diverse component attach complex stack-ups and advanced molding technologies (Transfer and Compression)
- Define and implement simplified lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time
- Establish stable high-speed parameters for multi-chip attach and advanced wire bonding technologies ensuring structural integrity and electrical performance in leaded modules
- Apply comprehensive technical expertise in Leadframe Direct Bonded Copper (DBC) and MIS manufacturing to optimize module reliability and thermal performance
Requirements
- Bachelors degree in Mechanical Engineering Physics Material Science or a related field of study
- Minimum 5 years-experience in the semiconductor field
- Expert level experience in process development for power stage multi chip module.
- Package layer design expertise such as structural configuration material selection and process flow design
- Hands on skills in operating machines and knowledge to down-select material process optimization and yield improvement
- Expert experience of using ANSYS / FEA for stress modeling.
Benefits
- Competive Salary
- Career Growth Plans
Required Skills:
Semiconductor Assembly & Packaging
Required Education:
Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology on experience on system-in-Package (SiP) including multi chip package or package on package is added of power stage packaging design including understanding of Design for Manufacturability (DFM) constraints and defect in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
