Package Characterization Lab Manager, APTD

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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description

As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD) you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction own lab operational excellence and workforce development ensuring timely highquality results that directly impact critical APTD technical decisions. This role partners closely with Microns global engineering labs subject-matter experts and external vendors to expand lab capability efficiency and ensure forward-looking readiness for new technologies.

Responsibilities and Tasks

Lab Management Compliance & Audits

• Lead Package Characterization lab operations to meet key performance metrics cycle-time and safety standards.
• Plan and optimize FA lab equipment space and budget to support current and future needs with high utilization efficiency.
• Coordinate timely equipment calibration (external vendors) repairs and spare parts procurement to ensure sustained equipment uptime.
• Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subjectmatter experts.
• Lead various EHS quality TS ISO14001 OHSAS and customer audits with a strong safetyfirst culture.

Technical Leadership & CrossFunctional Partnership

• Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures.
• Collaborate crosssite to benchmark standardize best-known methods to improve lab efficiency and effectiveness.
• Ensure FA lab readiness for new product designs and technologies.
• Align task priorities and execution with APTD team members providing recommendations for optimal lab tool/resource usage.
• Deliver timely clear and actionable package analysis insights to enable datadriven technical and business decisions.

Workforce Development & Performance Management

• Build and sustain a robust training and development program including handson FA casework crosssite learning and leadership mentoring.
• Define track and review performance metrics to identify gaps drive accountability and build a highperforming team.
• Provide mentorship regular coaching communication and career development for lab engineers and technicians.

Requirements

• Bachelors degree or higher (Masters/PhD preferred) in Materials Science Physics Chemistry or related field.
• 8 years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.
• Knowledge of package FA tools and techniques including SEM EDX FIB TEM AFM FTIR XPS Xray CSAM ion milling delayering and decapsulation.
• Knowledge of semiconductor or advanced packaging manufacturing processes.
• Experience in lab management shift resource planning and budgeting.
• Proven technical leadership and people management capability.
• Strong written and verbal communication skills with a customerfocused mentality

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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