Technologist, Advanced Packaging Director

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

What We Offer

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Youll benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials we care about the health and wellbeing of our employees. Were committed to providing programs and support that encourage personal and professional growth and care for you at work at home or wherever you may go. Learn more about our benefits.

About the Role

We are seeking a highly skilled Advanced Packaging Technologist to join the Disruptive Technology Pathfinding team within Applied Materials Advanced Packaging division. This role focuses on advanced packaging process integration with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates. This role leads and/or develops and executes exceptionally complex technology and engineering development projects.

Key Responsibilities

• Lead cross-functional efforts to develop and enable next-generation packaging concepts architectures and technologies
• Define document and implement end-to-end process flows for panel-level packaging technologies
• Lead material selection characterization and compatibility assessments for large form factor substrates
• Partner with customers to define and align process specifications and acceptance criteria
• Collaborate with business units on process development (lithography etch thin films etc.) module co-optimization and technology transfer to customers
• Contribute to Applieds equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
• Analyze process data to identify trends drive optimization and improve performance
• Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability
• Within established safety guidelines design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative practical solutions
• Publish and present technical findings at leading industry conferences and in peer-reviewed journals
• Mentor and guide early-career engineers; provide technical direction and best practices

Requirements

• Masters degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering Materials Science Chemical Engineering or related field
• In-depth knowledge and hands-on experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP) (organic) interposer substrate and wafer-level back-end technologies and related process flows
• Expertise in semiconductor processing and integration including lithography dry etch thin film deposition and materials modification techniques on wafer and/or panel-level
• Strong understanding of process equipment and packaging specific materials including selection criteria process interactions and performance trade-offs
• Proficiency in statistical data analysis (e.g. DoE JMP)
• Knowledge of industry standards and best practices in semiconductor packaging
• Solid understanding of process characterization metrology materials & failure analysis
• Working knowledge of reliability requirements and qualification methodologies
• Proven capability to lead multi-functional teams to resolve complex technical problems
• Exceptional written and verbal communication skills
• Develop clear compelling technical presentations and executivelevel slides to effectively convey complex concepts
• Drive structured technical discussions with customers and suppliers
• Articulate positions influence decisions and align technical direction
• Ability to produce highquality technically rigorous written content such as reports white papers and publications
• Ability to work effectively across geographies and time zones

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

In addition Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process please contact us via e-mail at or by calling our HR Direct Help Line at option 1 and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.