Engineering WSDegree Intern – CMP Process Engineering

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design development and fabrication services to some of the worlds most innovative technology companies. With a global manufacturing footprint spanning three continents GlobalFoundries enables the technologies that transform industries and empower customers to shape their markets. Learn more at .

Role Summary

GlobalFoundries Singapore is seeking highly motivated Engineering WSDegree Interns to join our state-of-the-art semiconductor manufacturing facility. This role is designed to progressively develop interns from foundational semiconductor process learning to in-depth CMP process engineering exposure culminating in a Final Year Project (FYP) aligned with real-world fab challenges.

Key Responsibilities

Block 1: Foundational Learning & Exploration

• Acquire fundamental knowledge of the semiconductor industry and wafer manufacturing processes
• Understand the function and purpose of Chemical Mechanical Planarization (CMP) within a wafer fab
• Learn cleanroom protocols safety requirements and fab operations standards
• Gain exposure to quality process and manufacturing control methodologies
• Learn CMP process fundamentals materials consumables and process flow
• Become familiar with MES fab operations and engineering systems
• Job shadow CMP Process Engineers to understand daily operations

Block 2: Process Study Data Analysis & Troubleshooting

• Deepen understanding of wafer processing and CMP process flows
• Learn about process parameters configurations and optimization techniques
• Perform data analysis and basic troubleshooting to improve process performance
• Monitor wafer quality performance using tools such as Statistical Process Control (SPC) and Fault Detection & Classification (FDC)

Block 3 & Final Year Project (FYP): EngineerinTraining Development

• Work with an assigned mentor to define FYP scope objectives and resources
• Execute an FYP aligned to CMP process engineering with increased technical depth and challenge
• Study process capability and collaborate with cross-functional partners to perform DOE (Design of Experiments) for CMP material evaluation and qualification
• Analyze data to improve process stability defect reduction and yield performance
• Participate in continuous improvement initiatives supporting cost quality or productivity
• Complete FYP under guidance of an industrial mentor

Skills & Experience Gained

Technical Skills

• Hands-on experience in semiconductor manufacturing
• Strong understanding of wafer fabrication processes and CMP functionality
• Knowledge of SPC FDC process control systems and metrology
• Independent data analysis and structured problem-solving

Soft Skills

• Effective presentation and communication skills
• Collaboration within cross-functional and dynamic teams
• Exposure to AI and Machine Learning concepts and applications

Practical Experience

• Work in a state-of-the-art cleanroom environment
• Project management experience in a cross-functional setting
• Networking opportunities including management roundtables and inter-department engagement

Required Qualifications

• Enrolled in a Mechanical Chemical Materials Electrical or Electronics Engineering degree
• Strong analytical and problem-solving skills
• Curious proactive and eager to learn
• Creative innovative and detail-oriented
• Strong time management and communication skills
• Positive mindset with strong teamwork capabilities

Additional Information

• This role is exclusively for students enrolled in the WSDegree Programme (2026 intake)
• Internship period must be clearly stated in your CV resume or cover letter