Plating Equipment Engineer
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Job Location:
Kuala Lumpur - Malaysia
Monthly Salary:
Not Disclosed
Posted on:
Yesterday
Vacancies:
1 Vacancy
Job Summary
Job Summary
As a Plating Equipment Engineer at NXP Semiconductors Netherlands B.V. you will be responsible for the technical performance maintenance and continuous improvement of plating equipment within our semiconductor manufacturing facility. The role is critical in ensuring high-quality and high-volume production through expert equipment management and problem-solving.
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Job Responsibilities
* **Equipment Performance & Maintenance:**
* Oversee the day-to-day operation troubleshooting and maintenance of various plating equipment (e.g. electroplating electroless plating chemical mechanical planarization - CMP).
* Conduct regular preventative maintenance calibration and repair activities to minimize downtime and optimize equipment uptime.
* Analyze equipment performance data to identify trends potential issues and areas for improvement.
* Implement corrective and preventive actions for equipment-related defects and failures.
* **Process Improvement & Optimization:**
* Collaborate with process engineers to optimize plating parameters and equipment settings for enhanced yield quality and cost-efficiency.
* Participate in the evaluation selection and qualification of new plating equipment and technologies.
* Drive continuous improvement initiatives to enhance equipment reliability throughput and process stability.
* Develop and update maintenance procedures best practices and standard operating procedures (SOPs).
* **Technical Support & Training:**
* Provide technical expertise and support to manufacturing operations and technicians.
* Train and mentor junior engineers and technicians on equipment operation maintenance and troubleshooting.
* Act as a technical liaison with equipment vendors for support upgrades and issue resolution.
* **Safety & Compliance:**
* Ensure all equipment operations and maintenance activities adhere to safety regulations environmental standards and NXPs quality management systems.
* Participate in safety audits and implement necessary safety improvements.
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Job Qualifications
* Knowledge of plating process (e.g. electroplating electroless plating CMP) is highly preferred.
* Familiarity with semiconductor fabrication processes and cleanroom requirement.
* **Technical Skills:**
* Strong understanding of mechanical electrical and control systems related to complex manufacturing equipment.
* Knowledge in troubleshooting and root cause analysis methodologies (e.g. FMEA 8D).
*Knowledge with statistical process control (SPC) and data analysis tools.
* Knowledge of automation systems and programmable logic controllers (PLCs) is a plus.
* **Soft Skills:**
* Excellent problem-solving and analytical skills.
* Strong communication and interpersonal skills with the ability to collaborate effectively with cross-functional teams.
* Ability to work independently and as part of a team in a fast-paced manufacturing environment.
* Proactive and results-oriented mindset with a focus on continuous improvement.
* Proficiency in English (both written and spoken).
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Required Experience:
IC
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
