Package Layout Design Engineer , Annapurna Labs AI Silicon Packaging
Share
Job Location:
Austin, TX - USA
Monthly Salary:
Not Disclosed
Posted on:
2 days ago
Vacancies:
1 Vacancy
Job Summary
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on technical challenges that have never been seen before and deliver results that help our customers change the world.
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role you will execute package layout tasks from floor planning through tape out and manufacturing release working closely with senior engineers SI/PI thermal and manufacturing teams to deliver production-ready designs that meet performance density and reliability targets.
Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning bump/pad assignment RDL routing substrate design verification and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer 3D-IC fan-out wafer-level packaging and silicon bridge technologies (e.g. CoWoS EMIB or similar).
- Support package floorplan development considering die placement bump maps power/ground distribution signal escape routing and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps C4 bumps TSVs microvias and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL interposer/substrate and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC connectivity shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout impedance-controlled routing power plane optimization and critical net shielding.
- Bachelors degree in Electrical Engineering or a related field
- 5 years of experience in IC package layout and physical design
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
- Hands-on experience with package layout tools such as Cadence APD/SiP Synopsys IC Packaging Mentor Xpedition or equivalent
- Understanding of advanced packaging technologies: 2.5D/3D-IC fan-out WLP RDL TSV microbump or silicon bridge interconnects
- Working knowledge of package design rules DFM constraints and physical verification methodologies (DRC connectivity checks)
- Experience with bump map and ball map definition escape routing strategies and power/ground plane design
- Good communication skills with the ability to work effectively across design SI/PI and manufacturing teams
- MS with 3 years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes material properties and their impact on design decisions
- Exposure to chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control PDN layout crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
- Experience developing automation scripts (Python TCL Skill Ravel) for layout tasks or design rule checks
- Exposure to working with OSAT partners on NPI builds or yield improvement efforts
- Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role you will execute package layout tasks from floor planning through tape out and manufacturing release working closely with senior engineers SI/PI thermal and manufacturing teams to deliver production-ready designs that meet performance density and reliability targets.
Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning bump/pad assignment RDL routing substrate design verification and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer 3D-IC fan-out wafer-level packaging and silicon bridge technologies (e.g. CoWoS EMIB or similar).
- Support package floorplan development considering die placement bump maps power/ground distribution signal escape routing and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps C4 bumps TSVs microvias and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL interposer/substrate and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC connectivity shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout impedance-controlled routing power plane optimization and critical net shielding.
- Bachelors degree in Electrical Engineering or a related field
- 5 years of experience in IC package layout and physical design
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
- Hands-on experience with package layout tools such as Cadence APD/SiP Synopsys IC Packaging Mentor Xpedition or equivalent
- Understanding of advanced packaging technologies: 2.5D/3D-IC fan-out WLP RDL TSV microbump or silicon bridge interconnects
- Working knowledge of package design rules DFM constraints and physical verification methodologies (DRC connectivity checks)
- Experience with bump map and ball map definition escape routing strategies and power/ground plane design
- Good communication skills with the ability to work effectively across design SI/PI and manufacturing teams
- MS with 3 years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes material properties and their impact on design decisions
- Exposure to chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control PDN layout crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
- Experience developing automation scripts (Python TCL Skill Ravel) for layout tasks or design rule checks
- Exposure to working with OSAT partners on NPI builds or yield improvement efforts
- Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience qualifications and location. Amazon also offers comprehensive benefits including health insurance (medical dental vision prescription Basic Life & AD&D insurance and option for Supplemental life plans EAP Mental Health Support Medical Advice Line Flexible Spending Accounts Adoption and Surrogacy Reimbursement coverage) 401(k) matching paid time off and parental leave. Learn more about our benefits at CA Cupertino - 157300.00 - 212800.00 USD annually
USA TX Austin - 136000.00 - 184000.00 USD annually
Required Experience:
IC
About Company
Free shipping on millions of items. Get the best of Shopping and Entertainment with Prime. Enjoy low prices and great deals on the largest selection of everyday essentials and other products, including fashion, home, beauty, electronics, Alexa Devices, sporting goods, toys, automotive ... View more
