Sr System Design Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

The HBM DTPCO (Design Technology Packaging Co-Optimization) Characterization Engineer is a highly technical hands-on role focused on deep characterization of HBM cubes across thermal mechanical and electrical domains and on driving power performance area cost and time-to-market improvements.

The core mission of this position is to fundamentally understand HBM cube behavior and failure modes through meticulous bench testing structured experimentation and data-driven analysis. The engineer will generate high-quality characterization data connect observations across domains and translate insights into actionable structural technical packaging test and product solutions.
This role is key to achieving DTPCO objectives by building a first-principles understanding of the HBM cubes limitations. It involves validating hypotheses with silicon data and supporting modeling yield improvement and adaptability of next-generation HBM products. The role plans and performs custom bench-level HBM cube tests involving temperature mechanical stress and electrical elements. Tests cover steady-state and transient thermal effects power/thermal correlation warpage stress behavior IDD timing margins parametrics and fail signatures.

Responsibilities:

• Compose build and debug custom bench setups fixtures and measurement flows using lab equipment such as power supplies SMUs oscilloscopes thermal hardware handlers sockets and probe cards.

• Perform full thermal and mechanical stress characterization using bench stress platforms (e.g. Aroratype testers) while monitoring electrical behavior under controlled stress.

• Conduct hot/cold transient and forcedtemperature testing with precision thermal systems (e.g. Sensatatype chillers or thermal forcing units) to enable powertemperature correlation and failureonset analysis.

• Develop Python Verilog and C/Cbased test programs to build targeted stress patterns segmented workloads custom modes and observability hooks that accelerate rootcause isolation.

• Drive correlation of bench results with assembly test and system-level data including DOE-based studies to isolate sensitivities and interactions across thermal mechanical electrical and structural domains.

• Analyze MBIST signatures and electrical or thermal behavior. Trace issues back to building technology package or assembly root causes. Collaborate with test teams on improved screens and content.

• Lead failuremode identification and statistical analysis of multifaceted datasets to deliver clear evidence-backed recommendations for building process package or test mitigations while partnering closely with HBM Build DTPCO Technology Development Packaging Test Product Engineering and Reliability teams.

Minimum Qualifications

• A BS or equivalent experience with 8 years of proven experience is also acceptable. A Masters degree or equivalent experience in electrical engineering computer engineering mechanical engineering materials science or a related field is required.

• Strong fundamentals in semiconductor devices memory architectures and manufacturing/process flow.

• Hands-on experience with silicon or package-level characterization bench/ATEtesting or product/test engineering.

• Confirmed understanding of electrical measurement techniques lab instrumentation and test platforms.

• Experience with programming and data analysis (Python JMP/JSLC/C or similar).

• Proven understanding of statistics and experimental methods (DOE).

• Ability to independently debug sophisticated problems and synthesize conclusions from incomplete or noisy data.

Preferred Qualifications

• Direct experience with HBM DRAM or advanced memory products.

• Experience running or analyzing MBIST-based testing and correlating to silicon behavior.

• Background in package product engineering test solutions engineering or silicon characterization.

• Familiarity with thermal and mechanical modeling concepts and correlation to lab data.

• Experience working across design technology package and test teams to close issues.

• Demonstrated ability to turn characterization data into actionable engineering decisions.

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

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