Technical Director, Advanced Packaging Integration

Applied Materials

Job Location:

Singapore - Singapore

Monthly Salary: Not Disclosed

Posted on: 16 days ago

Vacancies: 1 Vacancy

Job Summary

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

What We Offer

Location:

SingaporeSGP

Youll benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials we care about the health and wellbeing of our employees. Were committed to providing programs and support that encourage personal and professional growth and care for you at work at home or wherever you may go. Learn more about our benefits.

About the Role

We are seeking a highly skilled Advanced Packaging Technical Director to join the Disruptive Technology Pathfinding team within Applied Materials Advanced Packaging division. This role focuses on advanced packaging process integration with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates. This role leads and/or develops and executes exceptionally complex technology and engineering development projects.

Key Responsibilities

Lead cross-functional efforts to develop and enable next-generation packaging concepts architectures and technologies
Define document and implement end-to-end process flows for panel-level packaging technologies
Lead material selection characterization and compatibility assessments for large form factor substrates
Partner with customers to define and align process specifications and acceptance criteria
Collaborate with business units on process development (lithography etch thin films etc.) module co-optimization and technology transfer to customers
Contribute to Applieds equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps
Analyze process data to identify trends drive optimization and improve performance
Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability
Within established safety guidelines design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative practical solutions
Publish and present technical findings at leading industry conferences and in peer-reviewed journals
Mentor and guide early-career engineers; provide technical direction and best practices

Requirements

Masters degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering Materials Science Chemical Engineering or related field
In-depth knowledge and hands-on experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP) (organic) interposer substrate and wafer-level back-end technologies and related process flows
Expertise in semiconductor processing and integration including lithography dry etch thin film deposition and materials modification techniques on wafer and/or panel-level
Strong understanding of process equipment and packaging specific materials including selection criteria process interactions and performance trade-offs
Proficiency in statistical data analysis (e.g. DoE JMP)
Knowledge of industry standards and best practices in semiconductor packaging
Solid understanding of process characterization metrology materials & failure analysis
Working knowledge of reliability requirements and qualification methodologies
Proven capability to lead multi-functional teams to resolve complex technical problems
Exceptional written and verbal communication skills
Develop clear compelling technical presentations and executivelevel slides to effectively convey complex concepts
Drive structured technical discussions with customers and suppliers
Articulate positions influence decisions and align technical direction
Ability to produce highquality technically rigorous written content such as reports white papers and publications
Ability to work effectively across geographies and time zones

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes 20% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

Required Experience:

Director

Who We AreApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices...