2026- Failure Analysis Intern

This is a summer Internship program for graduates from Nov 2026 to Oct. 2027. Interview progress will start from the week of 23rd Mar.
欢迎2026年11月至2026年10月毕业的同学加入TI暑期实习项目面试将于3月23日正式开启

Change the world. Love your job.

Heres your chance to work as part of a dynamic and challenging engineering team on the latest semiconductor technology. This engineer will have significant exposure to multiple engineering disciplines making this an excellent base for future career progression.

Many projects provide the opportunity for learning semiconductor wafer fab and assembly processing while interfacing with design engineering product engineering test engineering and quality engineering groups. Selected candidates will be assigned to one of several important but different roles:

• Fab Quality Assurance Engineer - conduct frequent analysis of fab process control data review release and assist in the troubleshooting of fab processes; participate and assist in managing local audit programs; verify conformance of manufactured IC devices and process materials to relevant TI and customer specifications.
• Failure Analysis Engineer - perform failure analysis on products to determine the root cause of failure; work in cross-functional teams to resolve analysis issues; provide progress reports of analysis as well as a final written report of analysis and findings; and meet cycle time and success rate metrics established for customer satisfaction and quality team success.
• Customer Quality Engineer - manage customer returns and use TI tools to provide frequent status updates to affected customers; work effectively with test design product and planning engineers regional quality engineers regional planners regional technical sales representatives and marketing representatives to solve customer challenges and provide answers.

Put your talent to work with us as a Quality Engineer !

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

Minimum Requirements:

• Pursuing an undergraduate or graduate degree in Electrical Engineering or Electrical & Computer Engineering
• Minimum Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications:

• Strong verbal and written communication skills
• Demonstrated strong analytical and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in a fast-paced and rapidly changing environment
• Demonstrated ability to build strong influential relationships
• Coursework providing knowledge and background in semiconductor processing process control methodology and/or device failure analysis.