Packaging Engineer Inductor and Power Module

Change the world. Love your job.

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team youll have the chance to interact with many product groups and functions. Youll have high visibility on your projects with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities may include:

• Lead the definition development and realization ofcomprehensive low-profile inductorsplanar magnetics andintegrated passives roadmaps to enable ultra-compact high-density high current (100-300A) power delivery modulesfor enterprise and AI infrastructure.
• Develop strategic relationships and partnerships with leading suppliersworldwide to co-developmagnetic materials inductors capacitors and packaging technologiesthat meet performance reliability and scaling needs.
• Ensure manufacturability testability and reliability through early-stage DfX material qualification and close supplier collaboration.
• The candidate must be a proven leader capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.

Minimum requirements:

• MS in Electrical Engineering Materials Science or a related field with deep focus onmagnetics and power packaging
• 10 years of hands-on experience in power inductor design supportingadvanced power topologies includingTLVR & multiphase coupled inductors (upto 20MHz)with a track record of joint development qualification and scaling
• Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth Steinmetz models Ollendorf models for composite materials etc.
• Experience with Material Characterization (ex; BH analyzer VSM SEM EDX)
• Experience in advanced co-packaged power modules
• Strong IP generation background in magnetics packaging or passive integration domains

Preferred qualifications:

• PhD in Electrical Engineering Materials Science or a related field with deep focus onmagnetics and power packaging
• System-level understanding of power delivery architectures thermal management EMI and reliability constraints
• In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn) metal materials (Fe FeNi FeSiCr FeSiAl amorphous & nano crystalline materials)
• Familiarity with high-frequency magnetic material behavior loss modeling and reliability testing. Hands on knowledge of simulation tools and techniques likeMaxwell Ansys Femtet homogenization and model order reduction optimization tools (NN AI/ML)
• Understanding of material processing: ceramic metal powder and composite materials
• Familiarity with inductor coil forming and termination processes: wire wounded multilayer metal composite thin film etc.
• Deep insights in magnetic supplier capabilities roadmaps and emerging research