Camera Module Process Engineer

Shanghai - China

Monthly Salary: Not Disclosed

Posted on: Yesterday

Vacancies: 1 Vacancy

Job Summary

Key Qualifications

Over 7 years of hands-on experience in semiconductor IC or module packaging especially on Camera Module or related processes.

Process technology knowledge in SMT and advanced IC / camera module

packaging areas

Knowledgeable in advanced process equipment such as Flip Chip Die and Wire Bonding Molding Wafer Dicing Laser Singulation Lens Holder / Active Alignment Process & etc.

Experienced working with subcontract manufacturing partners.

High volume manufacturing and production ramp experience.

Knowledgeable in production control processes machine commissioning data analysis/interpretation GR&R Cp/Cpk and correlation analysis

Fluent in English communication additional language skills a plus.

Demonstrated ability to perform DOE data analysis SPC control.

Demonstrated failure mode analysis root cause investigation and problem solving for product yield and quality issue.

Project Management- Excellent data handling documentation critical milestone creation and organization skill

Strong collaboration skill to work with diversified x-function team.

Description

Develop Camera Module assembly process / equipment / materials for FOL (Front of Line) and EOL (End of Line) - Develop new assembly process / equipment / material for Camera module related components - Provide technical leadership in resolving any process issues - Responsible for developing DOEs

Statistical Process Analysis Process Specification D/PFMEA and Process

control plan - Responsible for Failure analysis Corrective actions and Yield improvement

Process technology feasibility studies through theoretical simulation and/or practical engineering methods Process Development - Leads design and development of technically complex manufacturing processes including material selection parameter optimization equipment metrology and system design to enable new products designs & functional requirements.

Develop Process for Manufacturability - Provide early and ongoing manufacturing

leadership to ensure new process is scalable for high volume Process FMEA -

Lead PFMEA generation for new process technology Failure Analysis - Lead root cause analysis and metrology development for issues related to new process technology.

Supporting complex high volume camera module modules. Provide leadership in the areas of module construction materials equipment and processes.

Identify the correct product process flow compatible with high volume

manufacturing requirements. Work to develop key and new process/equipment/material for camera module. Participate in external vendor assessment and selection from MP intent equipment process to direct and indirect materials. Responsible for DOE planning statistical process analysis process specification and D/PFMEA.

Education & Experience

B.S. degree in Engineering (Mechanical Electronics Electrical Physics or equivalent)

Key Qualifications Over 7 years of hands-on experience in semiconductor IC or module packaging especially on Camera Module or related processes. Process technology knowledge in SMT and advanced IC / camera module packaging areas Knowledgeable in advanced process equipment such as Flip Chip Die...