Senior Package Design Engineer

Rambus

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profile Job Location:

San Jose, CA - USA

profile Monthly Salary: Not Disclosed
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

Overview

Rambus a premier chip and silicon IP provider making data faster and safer is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose this role you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer.

This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer you will be responsible for supporting the design and layout of new products from early concept to tape out focusing primarily on several elements that enable high-yielding low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio.

Rambus offers a flexible work environment embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite allowing for two days of remote work.

Responsibilities

  • Drive early chip-package co-design and development of bump and ball map.
  • Own layout of package types such as FCCSP FCBGA FCQFN WLCSP QFN.
  • Collaborate with multiple cross-functional teams (Chip Design SI/PI Packaging)
  • Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips.
  • Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution.
  • Continuous improvement of package design workflow and unified package design guidelines.
  • Assist with model creation for thermo-mechanical package simulations.

Qualifications

  • MS Degree in EE/CE
  • Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD.
  • 5 years of experience in packaging design and layout preferably in an advanced silicon node.
  • Proven track record with multiple packaging types where products have gone to volume production.
  • Experience routing high-speed high pin count devices and understanding of signal and power integrity fundamentals.
  • Knowledge of organic laminate substrate technologies and manufacturing capabilities.
  • Awareness of JEDEC standards and other specifications that may govern package design.
  • Understanding of package material properties related to high-volume production and reliability: temperature cycling HAST shock vibration thermal resistance outgassing etc.
  • Excellent communication initiative multi-tasking and time management.
  • Strong commitment and ability to work in cross functional and globally dispersed teams

About Rambus

Rambus is a global company that makes industry-leading memory interface chips and Silicon IP to advance data center connectivity and solve the bottleneck between memory and processing. With over 30 years of semiconductor experience we are a leading provider of high-performance products and innovations that maximize the bandwidth capacity and security for AI and other data-intensive workloads. Our world-class team is the foundation of our company and our innovative spirit drives us to develop thecutting-edgeproducts and technologies essential for tomorrows systems.

Rambus offers a competitive compensation packageincludingbase salary bonus equity matching 401(k) employee stock purchase plan comprehensive medical and dental benefits time-off program and gym membership.

TheUSsalary range for thisfull-timeposition is $110700to $205700.Our salary ranges aredeterminedby roleleveland location. The successful candidates starting pay will bedeterminedbased on job-related skills experience qualifications worklocationand market conditions.

At Rambus we are committed to fostering a workplace where every individual is respected supported and empowered to succeed. We value a range of perspectives and experiences that contribute to innovation and collaboration. Our goal is to ensure that all team members haveequitableaccess to opportunities resources and a sense of belonging. We believe that a culture of fairness and inclusion helps us all do ourbest work.


Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race religion color national origin sex (including pregnancy childbirth or related medical conditions) sexual orientation gender identity gender expression age status as a protected veteran status as an individual with a disability genetic information or other applicable legally protected characteristics.

Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veteransduringour job application procedures. If yourequireassistanceoran accommodationdue to a disabilityplease feel free to inform us in your application.

Rambus does not accept unsolicited resumes from headhunters recruitmentagenciesor fee-based recruitment services.

For more information about Rambus visit . Foradditionalinformation on life at Rambus and our current openings check out Experience:

Senior IC

OverviewRambus a premier chip and silicon IP provider making data faster and safer is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose this role you will be working with some of the brightest inventors and engineers in the world developi...
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Key Skills

  • Electrical Engineering
  • SOC
  • PCB
  • Warehouse Management
  • Warehouse Experience
  • CAD
  • Creo
  • SolidWorks
  • Data Mining
  • Digital design
  • Mechanical Engineering
  • Autocad

About Company

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Dedicated to making data faster and safer, Rambus creates innovative hardware and services that drive technology advancements to data centers, IoT, AI & more!

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