Your mission
Location: Stuttgart Germany
Type: Permanent employment full-time onsite with max. 1 day remote work per week
The future of AI computing builds on light. is building photonic processing systems that compute with light - delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
photonic integrated circuits are at the heart of this technology. You will drive the experimental verification and data analysis that turns fabricated PIC components into validated production-ready hardware. Beyond characterization you will contribute to the full photodiode-PIC integration lifecycle - from concept and design coordination through build validation and packaging - directly informing technology roadmap.
What You Will Do- Design and execute PIC characterization routines; perform experimental verification and tailored data analysis to extract and statistically evaluate key performance parameters
- Develop Python-based analysis tools and automation scripts for PIC performance evaluation and statistics
- Contribute to the full photodiode-PIC hybrid integration workflow - from initial concept and design coordination through assembly characterization and validation against target specifications and yield targets
- Implement novel characterization and evaluation schemes for new PIC modules and optoelectronic assemblies
- Coordinate closely with design layout characterization and system teams to align PIC analysis approaches and integration strategies
- Manage and coordinate external suppliers service providers and research partners - ensuring on-time aligned progress with clear status tracking and transparent communication
- Establish integration schedules define milestones and drive risk mitigation for novel PIC component integration
- Feed results and insights into technology and product roadmaps proposing new components and optimization strategies
- Ensure rigorous documentation of analysis steps code and results; maintain decision and action logs
Your profile
- Masters degree or Ph.D. in electrical engineering photonics or a related field - combined with initial work experience in a related field
- Deep understanding of photodiode physics and hybrid photonic-electronic integration
- Hands-on Python experience for measurement automation and data analysis (at least 1 year relevant)
- Practical experience in PIC testing optical alignment and optoelectronic system bring-up
- Familiarity with TFLN / LNOI platforms is a plus
- Strong communicator with demonstrated ability to coordinate across cross-functional teams and external partners
- Ability to think across systems - connecting component-level findings to subsystem behavior and roadmap decisions - and to influence technical direction without formal authority
- A structured problem-solving mindset: you identify novel approaches propose optimization strategies and take ownership of experimental outcomes
- Fluent English skills are a must; German is beneficial
Why us
What We Offer- Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes high impact from day one
- Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
- Own your work from day one: Shape characterization strategies integration workflows and roadmap inputs on your own with direct impact on product success
- Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP
- World-class team: Collaborate alongside a passionate international cross-functional team of experts in photonics electronics and packaging
- Direct access to leadership: Work closely with the companys founders including CEO Dr. Michael Förtsch and the senior leadership team
- Collaborative culture: Innovative work environment that values technical excellence open communication and pragmatic problem-solving
- Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation
We are looking for a hands-on engineer who gets energized by turning fabricated PIC components into validated hardware coordinating across teams and partners and directly shaping next-generation photonic technology.
Ready to push the boundaries of what photonic integrated circuits can do
We are looking forward to receiving your application!
is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany. Required Experience:
IC
Your mission Location: Stuttgart GermanyType: Permanent employment full-time onsite with max. 1 day remote work per weekThe future of AI computing builds on light. is building photonic processing systems that compute with light - delivering a scalable energy-efficient alterna...
Your mission
Location: Stuttgart Germany
Type: Permanent employment full-time onsite with max. 1 day remote work per week
The future of AI computing builds on light. is building photonic processing systems that compute with light - delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
photonic integrated circuits are at the heart of this technology. You will drive the experimental verification and data analysis that turns fabricated PIC components into validated production-ready hardware. Beyond characterization you will contribute to the full photodiode-PIC integration lifecycle - from concept and design coordination through build validation and packaging - directly informing technology roadmap.
What You Will Do- Design and execute PIC characterization routines; perform experimental verification and tailored data analysis to extract and statistically evaluate key performance parameters
- Develop Python-based analysis tools and automation scripts for PIC performance evaluation and statistics
- Contribute to the full photodiode-PIC hybrid integration workflow - from initial concept and design coordination through assembly characterization and validation against target specifications and yield targets
- Implement novel characterization and evaluation schemes for new PIC modules and optoelectronic assemblies
- Coordinate closely with design layout characterization and system teams to align PIC analysis approaches and integration strategies
- Manage and coordinate external suppliers service providers and research partners - ensuring on-time aligned progress with clear status tracking and transparent communication
- Establish integration schedules define milestones and drive risk mitigation for novel PIC component integration
- Feed results and insights into technology and product roadmaps proposing new components and optimization strategies
- Ensure rigorous documentation of analysis steps code and results; maintain decision and action logs
Your profile
- Masters degree or Ph.D. in electrical engineering photonics or a related field - combined with initial work experience in a related field
- Deep understanding of photodiode physics and hybrid photonic-electronic integration
- Hands-on Python experience for measurement automation and data analysis (at least 1 year relevant)
- Practical experience in PIC testing optical alignment and optoelectronic system bring-up
- Familiarity with TFLN / LNOI platforms is a plus
- Strong communicator with demonstrated ability to coordinate across cross-functional teams and external partners
- Ability to think across systems - connecting component-level findings to subsystem behavior and roadmap decisions - and to influence technical direction without formal authority
- A structured problem-solving mindset: you identify novel approaches propose optimization strategies and take ownership of experimental outcomes
- Fluent English skills are a must; German is beneficial
Why us
What We Offer- Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes high impact from day one
- Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
- Own your work from day one: Shape characterization strategies integration workflows and roadmap inputs on your own with direct impact on product success
- Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP
- World-class team: Collaborate alongside a passionate international cross-functional team of experts in photonics electronics and packaging
- Direct access to leadership: Work closely with the companys founders including CEO Dr. Michael Förtsch and the senior leadership team
- Collaborative culture: Innovative work environment that values technical excellence open communication and pragmatic problem-solving
- Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation
We are looking for a hands-on engineer who gets energized by turning fabricated PIC components into validated hardware coordinating across teams and partners and directly shaping next-generation photonic technology.
Ready to push the boundaries of what photonic integrated circuits can do
We are looking forward to receiving your application!
is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany. Required Experience:
IC
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