Application Engineering II Silicon Package Board
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Job Location:
Belo Horizonte - Brazil
Monthly Salary:
Not Disclosed
Posted on:
Yesterday
Vacancies:
1 Vacancy
Job Summary
At Cadence we hire and develop leaders and innovators who want to make an impact on the world of technology.
Cadence Design Systems is looking for a Application Engineer II: Silicon Package Board (SPB) team as a full-time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment using state of the art technology this is a great opportunity.
Job Description:
- The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies.
- Ability to understand schematic layout interposers integrated components.
- Working closely with our customers who are in the Advanced Packaging space
- Helping customers to adopt and proliferate our packaging solutions
- Consulting customers to understand their flow requirements and creating solutions that best meet their needs
- Conducting technical presentations technical training and product demonstrations including development of customized presentations
- Supporting technical evaluations and benchmarks
- Collaborating with Sales Management to identify and prioritize opportunities and to assist in developing winning sales strategies
- Help R&D and product engineers develop competitive and creative technical solutions
- Working with Cadence Engineering and Marketing to communicate requirements and drive resolution of issues
Requirements:
- Complete Bachelors in Electrical Electronics System Engineering Computer Science or related areas
- Excellent written and verbal communication skills
- Interest in learning new technologies
- Open to continued personal development to meet the evolving demands of the EDA industry
- Previous experience with Package or PCB Design
- Knowledge of scripting programming languages such as Tcl Perl Python bash csh
- Solid verbal and written communication skills
- Exceptional problem-solving skills
- Ability to work independently and productively in a fast paced and dynamic environment
Nice to have:
- Practical experience with Cadence IC packaging tools
- Knowledge of interposer technology the latest trends and the advancement of Heterogenous Integration applications
- Electromagnetics and RF related to IC Package and PCB Design
- Knowledge of EDA industry Signal and Power Integrity
Additional Job Details:
- Employment category: CLT
- Employment term: 40 hours/week.
- Competitive benefits.
- Location: Av Contorno 5800 Belo Horizonte Minas Gerais Brazil.
About Cadence Design Systems:
Cadence is the only company that provides the expertise and tools IP and hardware required for the entire electronics design chain from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live work and play. Our products are used in mobile consumer cloud datacenter automotive aerospace IoT industrial and other market segments. For more information access .
Be proud and passionate about the work you do. Together our One Cadence -- One Team culture drives our success.
Were doing work that matters. Help us solve what others cant.
Required Experience:
IC
Key Skills
- Load & Unload
- Ruby
- Shipping & Receiving
- Forklift
- Lift Truck Experience
- Basic Math
- Packaging
- Warehouse Experience
- Delivery Driver Experience
- Heavy Lifting
- Human Resources
- RF Scanner
About Company
Do you want to shape the future of technology? Cadence is leading the charge to solve some of technology’s toughest challenges. We work with the world’s most innovative companies, across a growing range of industries. Major trends that you hear about everyday – like artificial intell ... View more
