Electrical Engineer- High Speed Digital Hardware

Pleasanton, CA - USA

Monthly Salary: Not Disclosed

Posted on: 7 hours ago

Vacancies: 1 Vacancy

Job Summary

RESPONSIBILITIES:

Schematic & Layout: Design complex digital circuit boards using industry-standard EDA tools focusing on high-density interconnects (HDI).
FPGA Integration: Manage the pin-mapping and routing of 500 digital I/O lines ensuring thermal and mechanical constraints are met.
Signal Integrity (SI): Perform pre- and post-layout SI simulations to validate timing crosstalk and impedance matching for high-speed signals.
Power Electronics: Design and implement low-voltage DC-DC power supplies to provide stable rails for both the local PCB and peripheral boards.
ASIC/Chiplet Implementation: Lead the transition toward chiplet-based architectures strictly monitoring trace capacitance and signal loss.
Hardware Validation: Bring up initial prototypes in the lab; lead electrical integration and verification.

BASIC QUALIFICATIONS:

Education: Bachelors degree in Electrical Engineering Computer Engineering or a related technical field.
Experience: Graduate Degree or 3 years of experience in high-speed digital PCB design and layout
Technical Proficiency: Proven track record of routing high-pin-count Processors and working with high-speed digital interfaces.
SI Fundamentals: Solid understanding of transmission line theory impedance control and electromagnetic interference (EMI) mitigation.
Power Design: Experience designing buck/boost converters and LDOs for low-voltage digital rails.
Communication: Excellent communication skills with experience working with a cross-functional distributed team.
Self-starter mentality: Have a proactive approach to uncovering risks and managing dependencies.
System-oriented: Ability and desire to dive deep into the smallest detail

PREFERRED QUALIFICATIONS:

An ideal candidate would have familiarity with:

Advanced Modeling: Experience with SI/PI simulation software (e.g. Ansys SIwave Cadence Sigrity or HyperLynx).
Chiplet Expertise: Previous experience with ASIC integration or 2.5D/3D packaging concepts and their associated PCB-level challenges.
Connectivity: Experience designing custom high-density connectors or backplane interfaces.
Materials Knowledge: Familiarity with high-frequency PCB laminates (e.g. Rogers Megtron 6) and their impact on signal loss.

RESPONSIBILITIES: Schematic & Layout: Design complex digital circuit boards using industry-standard EDA tools focusing on high-density interconnects (HDI). FPGA Integration: Manage the pin-mapping and routing of 500 digital I/O lines ensuring thermal and mechanical constraints are met. Signal ...

RESPONSIBILITIES:

Schematic & Layout: Design complex digital circuit boards using industry-standard EDA tools focusing on high-density interconnects (HDI).
FPGA Integration: Manage the pin-mapping and routing of 500 digital I/O lines ensuring thermal and mechanical constraints are met.
Signal Integrity (SI): Perform pre- and post-layout SI simulations to validate timing crosstalk and impedance matching for high-speed signals.
Power Electronics: Design and implement low-voltage DC-DC power supplies to provide stable rails for both the local PCB and peripheral boards.
ASIC/Chiplet Implementation: Lead the transition toward chiplet-based architectures strictly monitoring trace capacitance and signal loss.
Hardware Validation: Bring up initial prototypes in the lab; lead electrical integration and verification.

BASIC QUALIFICATIONS:

Education: Bachelors degree in Electrical Engineering Computer Engineering or a related technical field.
Experience: Graduate Degree or 3 years of experience in high-speed digital PCB design and layout
Technical Proficiency: Proven track record of routing high-pin-count Processors and working with high-speed digital interfaces.
SI Fundamentals: Solid understanding of transmission line theory impedance control and electromagnetic interference (EMI) mitigation.
Power Design: Experience designing buck/boost converters and LDOs for low-voltage digital rails.
Communication: Excellent communication skills with experience working with a cross-functional distributed team.
Self-starter mentality: Have a proactive approach to uncovering risks and managing dependencies.
System-oriented: Ability and desire to dive deep into the smallest detail

PREFERRED QUALIFICATIONS:

An ideal candidate would have familiarity with:

Advanced Modeling: Experience with SI/PI simulation software (e.g. Ansys SIwave Cadence Sigrity or HyperLynx).
Chiplet Expertise: Previous experience with ASIC integration or 2.5D/3D packaging concepts and their associated PCB-level challenges.
Connectivity: Experience designing custom high-density connectors or backplane interfaces.
Materials Knowledge: Familiarity with high-frequency PCB laminates (e.g. Rogers Megtron 6) and their impact on signal loss.