Front End Central Product Integration Senior Staff Principal Engineer, Test & Product Yield Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

• Lead and drive global Product Integration initiativesto improve yield quality and benchmark performanceacross technology nodes and products.
• Centralize and synthesize project information(design requirements test challenges yield learning) from multiple global teams and drive execution to closure.
• Drive yield breakthroughsby understanding the endtoend test flow product design and operation packaging interactions and manufacturing processes while balancing yield vs. reliabilityrequirements.
• Foster technical innovationby characterizing device failure modes using deep knowledge of device architecture physics packaging interaction and available test/process knobs.
• Define and drive strategies to ensure Packaging Technology and ChipPackage Interactionare developed and qualified ahead of product qualification.
• Lead across functions and crosssite taskforces(Product Test Yield Design Fab Packaging Quality TD) to resolve yield and quality challenges in a timely manner.
• Promote network BestKnownMethod (BKM)development standardization and business process creation or reengineering to improve productivity and efficiency.
• Maintain strong working relationships with partners in Fab Technology Development Product Engineering Test Engineering Quality and Packaging teams.
• Communicate project status risks and proposals effectively through clear written reports and technical presentations.
• Proactively identify obstacles escalate when needed and partner with management to drive successful outcomes.
• Travel to Micron fab and development sites as needed to support project execution and alignment.

• Bachelors Masters or PhD degree in Electrical Engineering Microelectronics Physics Chemistry Materials Science Engineering or a related field.
• 2 years of experiencein one or more of the following:
  • Product Integration
  • Test Engineering
  • Yield Engineering
  • Design Engineering
  • BEOL semiconductor processing or process integration
• Strong knowledge of Semiconductor Device Physicsand DRAM product operations.
• Understanding of wafer fabrication process flows parametric/electrical testing and probe yield.
• Strong data analysis debugging troubleshooting and problemsolvingskills with attention to detail.
• Effective verbal and written communicationskills with the ability to present to both small and large technical audiences.
• Demonstrated ability to collaborate across functions and cultures building strong customer and coworker relationships.
• Ability to work independently with minimal supervision manage multiple priorities and stay organized.
• Intermediate to advanced PC skills including Microsoft Office.
• Willingness to travel approximately 2050%to support global project needs.
• Flexibility to adapt to changing priorities and take on additional responsibilitiesas needed.

• Experience in DRAM High Bandwidth Memory (HBM)products.
• Exposure to DRAM HPM advanced packaging chippackage interaction BEOL integration or layoutrelated topics.
• Experience working across Test Product Yield Design Packaging and Manufacturingorganizations.
• Proven ability to drive alignment and execution in central or networklevel roles.
• Strong curiosity about innovation continuous improvement and scalable solution development.

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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