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At Micron-Boise ID we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023 with DRAM production slated for the second half of the decade.
As a leader in the semiconductor industry we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry.
This job requisition is to seek senior technical leaders in the field of process engineering to join ID1 reporting directly to Director of DE/WP/CMP. As a member of technical staff (MTS) or Senior member of technical staff (SMTS) you will play a pivotal role in driving innovation leading technical projects defining the technical roadmap and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up. Your contribution will have a lasting impact on the DRAM industry!
Responsibilities for Process Engineering MTS/SMTS include (but not limited to):
Lead the development characterization and optimization ofDry Etch processesfor advanced DRAM structures.
Collaborate cross-functionally with integration metrology equipment and R&D teams to ensure process robustness and manufacturability.
Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
Evaluate and implement new etch technologies chemistries and hardware platforms.
Mentor and guide developing engineers; foster a culture of innovation and technical excellence.
Collaborate with equipment vendors and external partners to co-develop solutions.
Drive root cause analysis and continuous improvement initiatives for process-related issues.
Present findings and recommendations to executive leadership and global teams.
Required Qualifications:
Ph.D. or Masters degree in Electrical Engineering Materials Science Chemical Engineering Physics or related field.
Minimum10 yearsof hands-on experience inDry Etch process development preferably inDRAM or advanced memory technologies.
Proven track record of technical leadership in semiconductor process engineering.
Deep understanding of plasma etch mechanisms process control and defect mitigation.
Experience with advanced etch tools (e.g. Lam TEL AMAT) and process characterization techniques.
Strong analytical problem-solving and communication skills.
Ability to lead cross-functional teams and manage complex projects.
Preferred Skills:
Experience withhigh aspect ratio etchingcritical dimension control andselectivity challengesin DRAM.
Familiarity withdata analyticsDOE methodologies andSPC tools.
Knowledge ofintegration challengesin sub-20nm DRAM nodes.
As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.
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