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Perform electromagnetic extractions on interconnects in IC Packages and PCBs using tools such as Ansys HFSS Q3D SIWave etc.
Perform signal integrity circuit simulations on parallel digital interfaces such as DDR analog SerDes channels and Power Delivery Networks (PDN) using tools such as ADS Ansys Designer or HSpice.
Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN
Work closely with IP owners chip leads package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets
Perform frequency and time domain lab measurements on silicon die bare substrates PCBs and systems often using micro probe stations
Contribute to the documentation of the simulation / extraction flows and Design Guidelines
Interface with substrate and assembly suppliers through the packaging team to help drive packaging technology improvement for electrical performance such as 2.5D Integration and Substrates for high-speed applications
MS in EE with 6 years of experience or Ph.D. in EE with 3 years of experience or BS in EE with 8 years of experience in Signal Integrity / Power Integrity Analysis and Interconnect Design Optimization for Electrical Performance
Solid knowledge in Interconnect Electromagnetics Transmission Line Theory and Circuit Theory
Power user of Ansys HFSS Q3D SIWave and/or Cadence Sigrity Power SI
Power user of Ansys Designer HSpice or Agilent ADS
Working knowledge of Cadence APD and AutoCAD
Hands-on lab measurement experience with VNA TDR System & Oscilloscopes preferably with micro-probe stations
Strong communication analytical and organizational skills; attention to details in engineering analysis and project management
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.
Required Experience:
Staff IC
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor, enterprise software and security solutions.