Embedded Design Engineering Intern – Firmware

Leidos Defense Systems is seeking a talentedEmbedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. We have offices across the United States that provide responsive cost-effective engineering scientific and IT solutions in the defense space cyber and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

At Leidos our mission is to reach equip and teach students with an interest in the field of defense and aerospace. Running for over two decades the internship program has been a staple at Leidos giving interns hands-on experience in their future career path. With no shortage of work available interning with Leidos promises growth experience and unrivaled opportunity across the US.

This position is anEmbedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing integration testing and post-delivery support. Additional learning opportunities related to digital-signal processing (DSP) design printed circuit board (PCB) design experience with technical trade studies and evaluation of technology improvements will be provided to the engineering student through this internship.

Primary Responsibilities

• Designing embedded software and firmware
• Performing HDL simulations and software unit tests
• Hands-on laboratory testing with instrumentation test equipment and debug/test methods
• Performing in a collaborative engineering environment working closely with multi-disciplinary teams
• Working with platforms such as FPGAs microcontrollers microprocessors and mixed signal designs.

Basic Qualifications

• Currently enrolled in an accredited college / university and currently working towards a degree in Computer Engineering or a related field.
• Experience with C C or Rust embedded software programming through course work lab projects and previous internships.
• Demonstrates problem solving teamwork and communication skills.
• Holds a GPA of 3.0 or higher.
• Includes resume and unofficial transcripts in application.
• Must be a US Citizenand be able to obtain andmaintaina DoDSecretsecurity clearance.

Preferred Qualifications

Preference shown to candidates who have experience and/or working knowledge of:

• Utilizing modern Xilinx FPGA and SoC families and design tools(RFSoC Xilinx IP Cores AXI4 AXI-Stream)
• Basic knowledge of FPGA/Firmware languages (VHDL Verilog SystemVerilog assembly Rust)
• Experience with simulation and test frameworks
• RISC microprocessors architectures (ARM Cortex Microblaze PowerPC RISC-V)
• Memory architectures typesand caching
• GNU/Linux and developing kernel drivers
• Communication protocols such as: UART Ethernet SPI I2CCAN bus etc.
• Embedded operating systems (Linux VxWorks Integrity FreeRTOS Zephyr uC/OS-II)
• Electronics and PCBA design
• Leading design teams including technical leadership budgeting and scheduling

If youre looking for comfort keep scrolling. At Leidos we outthink outbuild and outpace the status quo because the mission demands it. Were not hiring followers. Were recruiting the ones who disrupt provoke and refuse to fail. Step 10 is ancient history. Were already at step 30 and moving faster than anyone else dares.

Original Posting:

Pay Range:

The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job education experience knowledge skills and abilities as well as internal equity alignment with market data applicable bargaining agreement (if any) or other law.