Electro Mechanical Design Engineer

Orlando, FL - USA

Monthly Salary: Not Disclosed

Posted on: 4 hours ago

Vacancies: 1 Vacancy

Job Summary

Title: ElectroMechanical Design Engineer
Job ID : 20212-1
Location: Orlando FL
Contract: 12-month contract to hire
Citizenship Requirement: US Citizenship required (Ability to Obtain Security Clearance)
Shift : 4/10-1st Shift

Job Description:

ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts integrating thin film semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

You will design prototype and test cutting edge packaging solutions while collaborating with electrical systems test and product design engineers. You will work side by side with Lockheed Martins senior Advanced Packaging SME gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include:

Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size weight power and reliability targets.

Developing detailed mechanical and electrical designs for thin film interconnects semiconductor dies and advanced thermal management features.

Creating and executing test plans to validate electrical performance thermal behavior and mechanical integrity of packaging prototypes.

Performing failure analysis and iterating designs based on test data simulation results and manufacturing feedback.

Preparing comprehensive design documentation including drawings BOMs specifications and verification reports.

Collaborating with cross functional teams (electrical systems test product design) to ensure seamless integration of packaging solutions into larger systems.

Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.

Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.

Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Required Experience:

CREO: 3-6 years

Materials: 2 years

CCA experience: 3-6 years

PCB board level design experience: 3 years

Thermal Analysis : 3 years

BOM and Windchill Release experience: 3-6 years

Technical Drawing: 3-6 years experience

Packaging experience : 3-6 years

#ElectroMechanicalEngineering
#ElectronicsPackaging
#AdvancedPackaging
#HeterogeneousIntegration
#CREODesign
#PCBDesign
#CCADesign
#ThermalEngineering
#SemiconductorPackaging
#AerospaceEngineering
#DefenseTechnology
#MechanicalDesign
#ProductDevelopment
#FailureAnalysis
#WindchillPLM
#EngineeringDesign
#PrototypeDevelopment
#HardwareEngineering
#ReliabilityEngineering
#NextGenElectronics

Title: ElectroMechanical Design Engineer Job ID : 20212-1 Location: Orlando FL Contract: 12-month contract to hire Citizenship Requirement: US Citizenship required (Ability to Obtain Security Clearance) Shift : 4/10-1st Shift Job Description: ElectroMechanical Design Engineer for the Advanc...