Microelectronics Engineer Mid to Experienced Level (Maryland)

Summary

As an Engineering and Physical Science professional you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise administer and perform scientific projects such as planning designing and constructing specialized equipment and ensuring adherence to sound engineering and scientific standards and principles. For more information please visit: the ever-increasing technological complexities in the world of Microelectronics we need talented Microelectronics Engineers to be part of our team designing assembling testing and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agencys mission.

Microelectronics Engineers utilize electrical computer mechanical and materials engineering knowledge and skills to design assemble test analyze and qualify the next generation of electronics hardware in support of the NSA mission.

The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer Microelectronics Process Engineer and Microelectronics Technology Engineer.

1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM) printed circuit board (PCB) high density redistribution layers 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:

- Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design
- Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL
- Knowledge of Digital/Analog Logic design/simulation functional verification Design For Test (DFT) testability analysis
- Understanding and development of assembly specifications in accordance with industry standards
- Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design
- Conduct research including studies experiments and investigations on new or alternate methodologies
- Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM) printed circuit board (PCB) high density redistribution layers 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:

- Participate in assembly and fabrication process improvement efforts
- Conduct research including studies experiments and investigations on new or alternate methodologies fabrication and/or assembly equipment
- Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics

3. A Microelectronics Technology Engineer is focused on the test failure and physical analysis of advanced microelectronics systems such as integrated circuits custom multichip modules (MCM) printed circuit board (PCB) high density redistribution layers 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include:

- Conduct environmental and reliability tests
- High-pin-count Integrated Circuit (IC) design and operation validation
- Parametric testing - Accelerated testing / qualification / screening
- Develop test plans according to industry and military specifications
- Design and develop test platforms
- Support quality assurance efforts for developed and fielded systems
- Disassembly and sample preparation for physical analysis of ICs for failure analysis
- Perform scanning electron microscopy (SEM) low energy electrons microscopy (LEEM) and/or atomic force microscopy (AFM)

When submitting your application please ensure that you fully populate all sections of the resume tool with all relevant skills experience and education as the resume entered into the tool will be the primary resume used to evaluate your application. Please do NOT populate the resume tool with - see resume.

Please attach an unofficial copy of your transcripts from all schools attended when applying for this position. Providing a copy of your transcripts is especially critical to ensure the positions coursework obligations have been met.

Conditions of employment

• All applicants and employees are subject to random drug testing in accordance with Executive Order 12564. Employment is contingent upon successful completion of a security background investigation and polygraph.

Qualifications

The qualifications listed are the minimum acceptable to be considered for the position.

For all 3 types of Microelectronics Engineers the degree must be in Engineering Physics or Materials Science from an accredited college or university or a relevant professional technical field (for example microelectronics semiconductor chemistry architecture computer science mathematics hydrology geology)

For all of the above degrees if program is not ABET EAC accredited it must include specified coursework.*

*Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics (b) strength of materials/stress-strain relationships (c) fluid mechanics hydraulics (d) thermodynamics (e) electromagnetic fields (f) nature and properties of materials/relating particle and aggregate structure to properties (g) solid state electronics (h) microprocessor applications (i) computer systems (j) signal processing (k) digital design (l) systems and control theory (m) circuits or generalized circuits (n) communication systems (o) power systems (p) computer networks (q) software development (r) Any other comparable area of fundamental engineering science or physics such as optics heat transfer or soil mechanics.



FOR MICROELECTRONICS PACKAGE DESIGN ENGINEER:

Relevant experience must be in one or more of the following: developing advanced microelectronics systems through the design of integrated circuits custom multichip modules (MCMs) printed circuit boards (PCBs) high density redistribution layers 3D multi-layer integrated technologies or system enclosures using electronic design automation (EDA) tools.

FULL PERFORMANCE
With a degree in Engineering entry is with a Bachelors degree plus 3 years of relevant experience or a Masters degree plus 1 year of relevant experience or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example microelectronics semiconductor chemistry architecture computer science mathematics hydrology geology) entry is with a Bachelors degree plus 3 years of relevant experience or a Masters or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelors degree plus 7 years of relevant experience or a Masters degree plus 5 years of relevant experience or a Doctoral degree plus 3 years of relevant experience. An Associates degree plus 8 years of relevant experience may also be considered.

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FOR MICROELECTRONICS PROCESS ENGINEER:

Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures custom multichip modules (MCMs) printed circuit boards (PCBs) high density redistribution layers 3D multi-layer integrated technologies or system enclosures.

FULL PERFORMANCE
With a degree in professional Engineering entry is with a Bachelors degree plus 3 years of relevant experience or a Masters degree plus 1 year of relevant experience or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example microelectronics semiconductor chemistry architecture computer science mathematics hydrology geology) entry is with a Bachelors degree plus 3 years of relevant experience or a Masters or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelors degree plus 7 years of relevant experience or a Masters degree plus 5 years of relevant experience or a Doctoral degree plus 3 years of relevant experience. An Associates degree plus 8 years of relevant experience may also be considered.



FOR MICROELECTRONICS TECHNOLOGY ENGINEER:

Relevant experience must be in one or more of the following: characterization test reliability or failure root cause analysis of advanced microelectronics systems such as integrated circuits custom multichip modules (MCMs) printed circuit boards (PCBs) high density redistribution layers 3D multi-layer integrated technologies or system enclosures.

FULL PERFORMANCE
With a degree in professional Engineering entry is with a Bachelors degree plus 3 years of relevant experience or a Masters degree plus 1 year of relevant experience or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example microelectronics semiconductor chemistry architecture computer science mathematics hydrology geology) entry is with a Bachelors degree plus 3 years of relevant experience or a Masters or Doctoral degree plus 1 year of relevant experience.

SENIOR
Entry is with a Bachelors degree plus 7 years of relevant experience or a Masters degree plus 5 years of relevant experience or a Doctoral degree plus 3 years of relevant experience. An Associates degree plus 8 years of relevant experience may also be considered.