Solidigm is seeking an innovative NAND Memory Package Integration Engineer to support the pathfinding and development of package technologies for Solid State Drive (SSD). In this role youll be responsible for pioneering packaging technologies to align with the SSD product roadmap. Youll work with the wafer fab and Assembly Test Subcon in process integration & development. Other responsibilities include driving and tracking package design milestones integrating product requirements into packaging solutions identifying and resolving packaging design issues and communicating design status.
Qualifications :
- BS Physics Chemistry Chemical Mechanical Electrical or other Engineering discipline
- 5-10 years of experience in semiconductor package development
- Knowledge in Silicon thin film processing and understanding of the interactions between silicon and Microelectronics package manufacturing
- Familiar with Silicon layout design
- Proficient in failure analysis at both silicon and package levels (EFA PFA) design of experiments and data analysis
- Proven abilities in program management communication teamwork planning and prioritization
Preferred Skills:
- Solid understanding of package substrate design from a signal integrity perspective
- Proficient with HSPICE Ansoft Q2D/Q3D or other field solvers
- Skilled in high-speed signal integrity power delivery and DDR package design
- Familiar with PCB assembly and package-to-board interconnects
- Knowledgeable about flip chip packaging
- Experience with AutoCAD and Cadence (APD Editor SIP)
Additional Information :
The compensation range for this role is $121280 - $194100. Actual compensation is influenced by a variety of factors including but not limited to skills experience qualifications and geographic location.
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Remote Work :
No
Employment Type :
Full-time
Solidigm is seeking an innovative NAND Memory Package Integration Engineer to support the pathfinding and development of package technologies for Solid State Drive (SSD). In this role youll be responsible for pioneering packaging technologies to align with the SSD product roadmap. Youll work with th...
Solidigm is seeking an innovative NAND Memory Package Integration Engineer to support the pathfinding and development of package technologies for Solid State Drive (SSD). In this role youll be responsible for pioneering packaging technologies to align with the SSD product roadmap. Youll work with the wafer fab and Assembly Test Subcon in process integration & development. Other responsibilities include driving and tracking package design milestones integrating product requirements into packaging solutions identifying and resolving packaging design issues and communicating design status.
Qualifications :
- BS Physics Chemistry Chemical Mechanical Electrical or other Engineering discipline
- 5-10 years of experience in semiconductor package development
- Knowledge in Silicon thin film processing and understanding of the interactions between silicon and Microelectronics package manufacturing
- Familiar with Silicon layout design
- Proficient in failure analysis at both silicon and package levels (EFA PFA) design of experiments and data analysis
- Proven abilities in program management communication teamwork planning and prioritization
Preferred Skills:
- Solid understanding of package substrate design from a signal integrity perspective
- Proficient with HSPICE Ansoft Q2D/Q3D or other field solvers
- Skilled in high-speed signal integrity power delivery and DDR package design
- Familiar with PCB assembly and package-to-board interconnects
- Knowledgeable about flip chip packaging
- Experience with AutoCAD and Cadence (APD Editor SIP)
Additional Information :
The compensation range for this role is $121280 - $194100. Actual compensation is influenced by a variety of factors including but not limited to skills experience qualifications and geographic location.
Powered by SmartRecruiters - Candidate Privacy Policy
Remote Work :
No
Employment Type :
Full-time
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