Process Engineer I-IV

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WORK STYLE DESIGNATION: Onsite / Hybrid (50% Remote)

WORK STYLE REQUIREMENT:Onsite - 80% / Remote - 20%

WORK LOCATION:NCP (Hillsboro OR) Office

EXPECTED PAY RANGE:$64811.80 - $146963.71 Annually

This pay range is for the positions base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.

• Perform all responsibilities in a safe manner. Comply with all company policies including Environmental Health and Safety procedures and requirements. Protect company intellectual property and confidential information.
• Quickly learn train and upskill to latest equipment and technology. Ability to learn through on-the-job training. Establish and maintain an awareness of maintenance and lab procedures.
• Responsible for hands-on process engineering development research and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes. Work with a team on projects and development-related tasks including data collection analysis and reporting to meet customer expectations.
• Ability to work within a matrix environment. Interface with internal customers managers and teammates within the organization.

• Hold a position-relevant understanding of the relationships between plasma principals etch fundamentals and hardware functionality and relates them to process/project impact.
• Hold a position-relevant understanding of business context technology and industry trends and competitor capabilities.
• Professionally represents the company to the customer; able to create internal and external documentation for projects and products including presentations technical reports and process engineering specifications.
• (PE IV) Responsible for hands-on process engineering development research and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes. Performs project and development related tasks including data collection analysis and reporting. The position is expected to be able to drive multiple projects simultaneously with a high level of autonomy; ensuring that necessary support is given to meet customer expectations.
• (PE IV) Ability to work within a matrix environment. Acts as a resource across the department working with diverse stakeholders across multiple teams and lead cross-team or cross group efforts involving more people. May lead small projects with manageable risks and resource requirements.
• (PE IV) Supports customer account and technology managers in support of product demos and other business development activities. May be expected to interface with Hitachis global engineering teams and their corporate R&D headquarters in Japan.

• (PE I) BS or MS Degree in Chemical Engineering Materials Science Electrical Engineering Physics or equivalent combination of education and work experience with various cleanroom and semiconductor equipment.
• (PE IV) BS MS or PhD Degree in Chemical Engineering Materials Science Physics or related field

• Prior work experience is not required. Experience developing plasma etch processes for semiconductors or other processes utilizing semiconductor manufacturing equipment is preferred.
• Experience working with semiconductor equipment is highly desirable.
• Experience working in a cleanroom or Fab is highly desirable.
• Minimum travel required (<5%). Some travel will be required for onsite customer support and training including possible travel to Japan.
• (PE IV) PhD with 3 years of relevant work experience; or MS with 6 years of relevant work experience; or BS with 8 years of relevant work experience. Plasma Etch Process Experience and/or semiconductor processing preferred.
• (PE IV) Possible travel to Japan for training or customer sites worldwide as needed. The employee must be willing to travel to Japan for specific training and/or projects as necessary.

• Ability to learn and understand dry etch/RIE and plasma science at an advanced level.
• Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
• Proficient engineering analytical and problem-solving skills. Understanding of and experience with the Scientific -depth understanding of Statistical Process Control (SPC) and Design of Experiments (DOE).
• Familiarity with working in a laboratory and ability to work in a clean room environment for extended hours.
• Ability to perform tasks requiring a high degree of manual dexterity. Ability to learn and operate Hitachi plasma etch systems and all associated metrology equipment involved in performing process engineering development projects and train new engineers in the use of these toolsets.
• Effective organization skills and demonstrated flexibility to adapt to shifting priorities to meet business needs and deadlines.
• Demonstrated proactive mindset dependability and ability to drive projects to completion with on-time delivery of milestones.
• Demonstrated excellent work ethic and self-motivation with the ability to focus on both accuracy and output in a complex and matrix work environment. Tolerance of ambiguity and flexibility to adapt to new situations. Be reliable and independent as well as work within a team and support each other.
• Excellent collaboration ability in a team environment. Must possess the ability to professionally build effective relationships with internal and external customers vendors and other stakeholders. Ability to connect with and maintain effective working relationships with management team and other employees.
• Ability to work overtime shift work and/or flexible schedule as needed.
• Excellent time management abilities including but not limited to punctuality for work and training on-time completion of assignments and strong preparation for assignments
• Proactively protects IP/confidentiality.
• Ability to adapt to new procedures concerning work in the facility. Create and maintain technical and/or procedural documentation.
• Maintain appropriate records and documentation for all work performed.
• Portray professionalism and pride in appearance while conforming to policy.
• Provide a positive attitude to all employees and customers.
• Demonstrated commitment to valuing diversity and contributing to an inclusive working and learning environment.
• (PE IV) Advanced understanding and experience with dry etch/RIE and plasma science.
• (PE IV) Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
• (PE IV) Strong engineering analytical/problem solving skills. Understanding of Scientific Method and experience using depth understanding of statistical process control (SPC) and design of experiments (DOE).

Equal Opportunity Employer (EOE)

If you require reasonable accommodation in completing this application interviewing completing any pre-employment testing or otherwise participating in the employee selection process please direct your inquiries to