Hardware Development Engineer Intern AIML Systems
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Job Location:
Monthly Salary:
Posted on:
10 hours ago
Vacancies:
1 Vacancy
Job Summary
请注意申请此实习岗位需要满足如下条件
毕业时间26年12月至27年9月之间毕业
面试时间26年2月开始
入职日期26年6月
实习时间暑期全职实习至少持续3个月
工作地点深圳市福田区深圳国际创新中心B座
简历要求请提供中英双语简历放在一个文件中
投递须知
1 填写简历申请时请把必填和非必填项都填写完整提交简历之后就无法修改了哦
2 学校的英文全称请准确填写
3 校招信息请参考校园招聘申请手册 Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics products such as the Kindle Kindle Fire Fire TV Echo and Ring devices. Were seeking a Hardware Development Engineer (HDE) Intern to join our innovative team working on hybrid software-hardware systems for AI deployment on device.
This internship focuses on optimizing hybrid software-hardware systems for on-device AI applications with emphasis on both hardware design and software implementation. The HDE Intern works closely with teams located in the US and China throughout the development cycle. As a member of the team you will assist in driving cross-functional communication within the region collaborating with both Hardware Engineering and Software Development teams.
Key job responsibilities
Work closely with Hardware Engineering teams and Software Development teams to optimize AI deployment on device
Assist in hardware-software co-optimization for consumer electronics applications including architecture design and system integration
Participate in electronic and electrical design troubleshooting and component testing for AI hardware accelerators
Implement and optimize software algorithms for AI/ML model deployment on embedded systems
Explore optimization methods including pruning quantization architecture optimization and hardware-software co-optimization
Support hardware design readiness for engineering builds and participate in hardware development reviews
Assist in the organization of technical documentation throughout the development cycle
Work closely with suppliers and manufacturing teams as needed
Travel domestically and internationally to supplier sites as needed to keep projects on schedule
- Speak write and read fluently in Mandarin
- Speak write and read fluently in English
- Currently enrolled in Masters degree program in Electrical Engineering Electronic Engineering Computer Engineering or related STEM field
- Must be in pre-final year of Masters program (graduating between Nov 2026 to Sept 2027)
- Demonstrated experience with programming languages such as C/C and Python
- Knowledge and experience with AI/ML technologies and frameworks
- Understanding of hardware systems for AI deployment including embedded systems design and hardware accelerators
- Can work 5 days per week during summer holiday for at least 3 months duration in Shenzhen
- Willing to work in Shenzhen and collaborate with international teams
- Knowledge of electronic design in consumer electronics
- Experience with AI/ML system deployment and model optimization techniques (pruning quantization etc.)
- Experience with FPGA development and embedded programming
- Understanding of Digital Signal Processing fundamentals
- Experience with hardware-software co-design methodologies
- Knowledge of on-device AI inference optimization
- Familiarity with AI hardware accelerators and custom silicon (e.g. edge AI processors)
- Experience with real-time system constraints and power optimization
- Excellent oral and written communication skills (Chinese and English)
- Strong organizational and problem solving skills
- Demonstrated critical thinking capability
- Self-motivated and proactive
- Previous technical internship experience
- Past experience or coursework in electronic design and AI/ML implementation
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
毕业时间26年12月至27年9月之间毕业
面试时间26年2月开始
入职日期26年6月
实习时间暑期全职实习至少持续3个月
工作地点深圳市福田区深圳国际创新中心B座
简历要求请提供中英双语简历放在一个文件中
投递须知
1 填写简历申请时请把必填和非必填项都填写完整提交简历之后就无法修改了哦
2 学校的英文全称请准确填写
3 校招信息请参考校园招聘申请手册 Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics products such as the Kindle Kindle Fire Fire TV Echo and Ring devices. Were seeking a Hardware Development Engineer (HDE) Intern to join our innovative team working on hybrid software-hardware systems for AI deployment on device.
This internship focuses on optimizing hybrid software-hardware systems for on-device AI applications with emphasis on both hardware design and software implementation. The HDE Intern works closely with teams located in the US and China throughout the development cycle. As a member of the team you will assist in driving cross-functional communication within the region collaborating with both Hardware Engineering and Software Development teams.
Key job responsibilities
Work closely with Hardware Engineering teams and Software Development teams to optimize AI deployment on device
Assist in hardware-software co-optimization for consumer electronics applications including architecture design and system integration
Participate in electronic and electrical design troubleshooting and component testing for AI hardware accelerators
Implement and optimize software algorithms for AI/ML model deployment on embedded systems
Explore optimization methods including pruning quantization architecture optimization and hardware-software co-optimization
Support hardware design readiness for engineering builds and participate in hardware development reviews
Assist in the organization of technical documentation throughout the development cycle
Work closely with suppliers and manufacturing teams as needed
Travel domestically and internationally to supplier sites as needed to keep projects on schedule
- Speak write and read fluently in Mandarin
- Speak write and read fluently in English
- Currently enrolled in Masters degree program in Electrical Engineering Electronic Engineering Computer Engineering or related STEM field
- Must be in pre-final year of Masters program (graduating between Nov 2026 to Sept 2027)
- Demonstrated experience with programming languages such as C/C and Python
- Knowledge and experience with AI/ML technologies and frameworks
- Understanding of hardware systems for AI deployment including embedded systems design and hardware accelerators
- Can work 5 days per week during summer holiday for at least 3 months duration in Shenzhen
- Willing to work in Shenzhen and collaborate with international teams
- Knowledge of electronic design in consumer electronics
- Experience with AI/ML system deployment and model optimization techniques (pruning quantization etc.)
- Experience with FPGA development and embedded programming
- Understanding of Digital Signal Processing fundamentals
- Experience with hardware-software co-design methodologies
- Knowledge of on-device AI inference optimization
- Familiarity with AI hardware accelerators and custom silicon (e.g. edge AI processors)
- Experience with real-time system constraints and power optimization
- Excellent oral and written communication skills (Chinese and English)
- Strong organizational and problem solving skills
- Demonstrated critical thinking capability
- Self-motivated and proactive
- Previous technical internship experience
- Past experience or coursework in electronic design and AI/ML implementation
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Required Experience:
Intern
Key Skills
- Arm
- Electrical Engineering
- SOC
- System Design
- Firmware
- C/C++
- PCB
- Sensors
- Fpga
- Digital design
- Assembly
- Product Development
About Company
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